Results 31 to 40 of about 7,263 (261)

Quantitative evaluation of voids in lead free solder joints

, 2015
Voiding in solder joints poses a serious reliability concern for electronic products. The aim of this research was to quantify the void formation in lead-free solder joints through X-ray inspections.
Takyi, Gabriel, Mallik, Sabuj, Njoku, Jude   +2 more
core   +1 more source

Ball Impact Reliability of Zn-Sn High-Temperature Solder Joints Bonded with Different Substrates

, 2014
In this study, the high-speed deformation behavior of solder joints formed withPb-free Zn-Sn and commercial Pb-Sn alloys bonded on different substrateswas investigated by the ball impact test method. Overall, Zn-Sn jointsexhibited greater impact strength
Tsung-Yun Pai, Yi-Shao Lai, Ying-Ta Chiu, Jenn-Ming Song, Meng-Ju Lin, Kun-Hung Hsieh   +5 more
core   +1 more source

Deformation behavior of lLeadless 60% Pb–40% Sn solder joints

, 1987
Room temperature deformation data of leadless solder joints are reported. The joints were sheared under cyclic, displacement controlled loading at frequencies between 0.001 and 0.01 Hz.
Ravichandran Subrahmanyan, Subrahmanyan, Ravichandran, Stone, Donald, Che-Yu Li, Donald Stone, Li, Che-Yu   +5 more
core   +1 more source

Effect of electron irradiation on microstructural evolution and mechanical properties of Sn3Ag0.5Cu solder joints

Journal of Materials Research and Technology
Power electronic devices face harsh radiation environments in deep space exploration. It is significant to study the reliability of solder joints of electronic devices in radiation environments.
Yang Liu, Yangjing Xia, Yuxiong Xue, Xuewei Zhao, Nannan Li, Zhengqiang Zhu, Chaoyang Xing   +6 more
doaj   +1 more source

The Correlation Between Cu/Sn Ratios and the Formation Speed of IMC-Cu Composite Micro Solder Joints

Journal of Harbin University of Science and Technology, 2021
In order to study the effect of different Cu/Sn ratios on the IMC-Cu interface behavior of composite micro solder joints, this article uses a combination of Transient Liquid Phase Welding and pressure,using foamed copper, pure Sn and Cu substrates as raw
SUN Feng-lian, LI Wen-peng, PAN Zhen
doaj   +1 more source

Effects of solder volume on formation and redeposition of Au-containing intermetallics in Au/Ni-SnAgCu-Ni(P) solder joints

, 2007
SnAgCu is one of the most promising candidates for lead-free solders to replace conventional eutectic SnPb solders. The effects of solder volume on interfacial reactions and microstructure evolution in Au/Ni-SnAgCu-Ni(P) solder joints have been ...
Chen, Hongtao, Tian, Yanhong, Wang, Chunqing, Yan, Cheng, Huang, Y.   +4 more
core   +1 more source

Machine Learning‐Assisted Inverse Design of Soft and Multifunctional Hybrid Liquid Metal Composites

Advanced Functional Materials, EarlyView.
A machine learning framework is presented for inverse design of synthesizable multifunctional composites containing both liquid metal and solid inclusions. By integrating physics‐based modeling, data‐driven prediction, and Bayesian optimization, the approach enables intelligent design of experiments to identify optimal compositions and realize these ...
Lijun Zhou, Yunsik Ohm, Ren‐Mian Chin, Olivia Kerr, Krithika Manohar, Mohammad H. Malakooti   +5 more
wiley   +1 more source

Interfacial reaction of Cu/SAC105/Cu solder joints reinforced with Ti nanoparticles under vacuum thermo-compression bonding

Journal of Materials Research and Technology
In this study, 0.3 wt% Ti nanoparticles (Ti NPs) were incorporated into Sn1.0Ag0.5Cu (SAC105) solder, and vacuum thermo-compression soldering was employed to fabricate two distinct solder joints: Cu/SAC105/Cu and Cu/SAC105-0.3Ti/Cu.
Chuanjiang Wu, Liang Zhang, Lei Sun, Xiao Lu, Chen Chen   +4 more
doaj   +1 more source

Microstructure, shear properties and corrosion resistance of Cu/Cu-In/Cu solder joints

Journal of Advanced Joining Processes, 2022
Transient liquid phase sintering can successfully fabricate reliable high-temperature solder joints at a relatively low joining temperature by forming intermetallic compounds.
Li Liu, Bo Zhao, Bang Jiang, Zhiwen Chen, Wei Huang, Zhou Luo, Song Du, Chunhua Zhang   +7 more
doaj   +1 more source

Swelling‐Induced Stress‐Assisted Transfer of Nanodiamond Arrays With a PVA Carrier Tape for Conformal Bio‐Integrated Sensing and Labelling

Advanced Functional Materials, EarlyView.
This work introduces a swelling‐induced, stress‐assisted water‐soluble PVA tape strategy to transfer‐print nanodiamond quantum‐sensor arrays onto soft, curved biological interfaces. The room‐temperature, water‐triggered process achieves >98% fidelity and residue‐free integration, enabling conformal quantum sensing on contact lenses, neural probes, and ...
Luyao Zhang, Lingzhi Wang, Xinhao Hu, Tai Nam Yip, Mingze Sun, Jixiang Jing, Lizhi Xu, Yuan Lin, Yong Hou, Zhiqin Chu   +9 more
wiley   +1 more source