Results 31 to 40 of about 2,422,228 (271)
Reliability Examinations of SAC Lead Free Solder Material [PDF]
Archives of Metallurgy and Materials, 2019 In this paper the effect of soldering technique and thermal shock test were investigated on SAC 305 solder joints, produced by two different solder method.
D. Koncz-Horváth +3 more
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Metals, 2019 In this paper, we investigated the intermetallic compound (IMC) morphology of aged (0, 200, 600 h) conventional Sn-37Pb and Pb-free Sn-4Ag-0.5Cu solder joints/(Ni-P/Au) UBM; the creep properties of the solder joints were evaluated using a shear punch ...
Sophal Hai, Hyo-Sun Yu
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Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder joints
Journal of Materials Research and Technology, 2023 The effect of SiC nano-phases (nano-particles and nano-fibers) addition into SAC0307 solder paste was investigated on the thermal and microstructural properties of the composite solder joints.
Agata Skwarek +5 more
doaj +1 more source
Effects of solder volume on formation and redeposition of Au-containing intermetallics in Au/Ni-SnAgCu-Ni(P) solder joints [PDF]
, 2007 SnAgCu is one of the most promising candidates for lead-free solders to replace conventional eutectic SnPb solders. The effects of solder volume on interfacial reactions and microstructure evolution in Au/Ni-SnAgCu-Ni(P) solder joints have been ...
Chen, Hongtao +4 more
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Effects of reflow profile and miniaturisation on integrity of solder joints in surface mount chip resistor [PDF]
, 2023 Integrity of solder joints of components in an electronic device is critical to the device reliability. Miniaturisation manufacturing trend in electronic products development has continued to challenge the shear strength of the solder joints in these ...
Eugene A. Ogbodo +18 more
core +1 more source
Effect of nano-Cr particles on solder joint properties of Sn-Zn-Bi-In/Cu brazing
Cailiao gongcheng, 2021 The new composite solder Sn-5Zn-10Bi-10In-xCr (x=0%, 0.1%, 0.3%, 0.5%, mass fraction) was made by adding different contents of nano-Cr particles to the Sn-Zn-Bi-In solder. The effect of nano-Cr particles on the microstructure, element distribution, phase
LIU Guang-zhu +4 more
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The Correlation Between Cu/Sn Ratios and the Formation Speed of IMC-Cu Composite Micro Solder Joints
Journal of Harbin University of Science and Technology, 2021 In order to study the effect of different Cu/Sn ratios on the IMC-Cu interface behavior of composite micro solder joints, this article uses a combination of Transient Liquid Phase Welding and pressure,using foamed copper, pure Sn and Cu substrates as raw
SUN Feng-lian, LI Wen-peng, PAN Zhen
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Dynamic properties of solders and solder joints
Journal de Physique IV (Proceedings), 2003 The high strain rate mechanical properties have been measured for three types of solder: 63% Sn 37%Pb, 96.5Sn 3.5 Ag and 95.5Sn 3.8Ag 0.7Cu. Bulk properties were measured using a split Hopkinson pressure bar (SHPB) at strain rates from 500 to 3000 s -1 . A novel method has been designed and used to measure the shear strength of solder joints at low and
Siviour, C +5 more
openaire +2 more sources
Journal of Materials Research and TechnologyWith the continuous advancement of integrated packaging technology, the dimensions of Sn-based interconnected joints are being steadily reduced. It is necessary to investigate the dependability of Sn-based solder joints with various size since the change
Sijin Li +7 more
doaj +1 more source
Nonlinear analysis of plastic ball grid array solder joints [PDF]
, 2001 A nonlinear finite element analysis was carried out to investigate the viscoplastic deformation of solder joints in a ball grid array (BGA) package under temperature cycle. The effects of constraint on print circuit board (PCB) and stiffness of substrate
Qin, Qinghua, Mai, Yiu-Wing, Yan, Cheng
core +2 more sources