Results 11 to 20 of about 2,422,228 (271)
Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions [PDF]
Engineering Failure Analysis, 2021 As temperature cycling drives fatigue failure of solder joints in electronic modules, characterisation of the thermal fatigue response of different solder alloy formulations in BGA solder joints functioning in mission-critical systems has become crucial.
J. Depiver, S. Mallik, E. Amalu
semanticscholar +2 more sources
Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB) [PDF]
Journal of Electronic Materials, 2020 Ball grid array (BGA) packages have increasing applications in mobile phones, disk drives, LC displays and automotive engine controllers. However, the thermo-mechanical reliability of the BGA solder joints challenges the device functionality amidst ...
J. Depiver, S. Mallik, E. Amalu
semanticscholar +2 more sources
Non-destructive orientation tracking of individual β-Sn grains in die-attach solder joints [PDF]
Journal of Synchrotron RadiationUnderstanding the failure mechanisms of Pb-free solder joints during thermal cycling is a critical issue in electronic packaging, where solder joints strongly influence device reliability and lifetime.
Jaemyung Kim +4 more
doaj +2 more sources
Analysis of surface mount technology solder joints [PDF]
, 1996 This thesis was submitted for the degree of Doctor of Philosophy and awarded by Brunel University.The factors determining the quality of surface mount technology (SMT) solder joints are numerous, and complex.
Hui, Ip Kee
core +8 more sources
Interfacial reaction and mechanical properties of Sn–Bi Cu core solder joints
Journal of Materials Research and TechnologySn–Bi solder, considered to be a lead-free solder that can be used in the packaging of heat-sensitive devices, has been attracting increasing attention from researchers due to its excellent mechanical properties. The microstructure evolution, interfacial
Shijie Ouyang +5 more
doaj +3 more sources
Anomaly Detection for Solder Joints Using β-VAE [PDF]
IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2021 In the assembly process of printed circuit boards (PCBs), most of the errors are caused by solder joints in surface mount devices (SMDs). In the literature, traditional feature extraction-based methods require designing hand-crafted features and rely on ...
Furkan Ulger, S. E. Yuksel, A. Yilmaz
semanticscholar +1 more source
Grain features of SnAgCu solder and their effect on mechanical behaviour of micro-joints [PDF]
, 2006 SnAgCu alloy, which promises compatible properties with Sn-Pb solder, has been identified as one of the most potential Lead-free solders for electronic interconnections. However, due to the miniaturization of solder joints, a micro-joint of this material
Changqing Liu (1249713) +3 more
core +6 more sources
Comparison between bulk and particle solder alloy on the performance of low-melting solder joints
Journal of Materials Research and Technology, 2023 The influence of uniformity and small size solder particles on microstructure evolution and mechanical performances of low temperature soldering joints was investigated.
Mingkun Yang +4 more
doaj +1 more source
Crystals, 2022 The Sn–Bi solder paste is commonly used in electronic assembly and packaging, but its brittleness causes poor reliability in shock environments. In this study, the mechanical reliability of Sn–Bi solder paste and Sn–Bi composite solder paste with ...
Lu Liu +3 more
doaj +1 more source
, 2021 This research sought to improve the properties of SAC305 solder joints by the addition of 1 and 2 wt.% Bi. The effects of bismuth doping on the microstructure, thermal properties, and mechanical performance of the SAC305-xBi/Cu solder joints were ...
S. Chantaramanee, P. Sungkhaphaitoon
semanticscholar +1 more source