Results 11 to 20 of about 7,263 (261)

Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications [PDF]

, 2021
Electronic manufacturing is one of the dynamic industries in the world in terms of leading technological advancements. Electronic assembly's heart lies the 'soldering technology' and the 'solder joints' between electronic components andsubstrate.
Joshua A. Depiver, Yiling Lu, Mallik, Sabuj, Emeka H. Amalu, Sabuj, Mallik, Amalu, Emeka H, Lu, Yiling, Sabuj Mallik, Depiver, Joshua Adeniyi, Amalu, Emeka H.; id_orcid, Depiver, Joshua A.   +10 more
core   +1 more source

The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates

Journal of Materials Research and Technology, 2023
The preparation of new solder joint materials for chip packaging by designing a variety of brazing material mixes has become one of the future research directions for solder joints. They added low melting point elements to traditional solder materials to
Shuye Zhang, Shaoan Wang, Shang Zhang, Xiangyu Chen, Chen Zeng, Kyung-Wook Paik, Peng He   +6 more
doaj   +1 more source

The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface

Journal of Materials Research and Technology, 2023
In recent years, in order to adapt to the trend of low-temperature assembly and integration, low-temperature hybrid solders with multiple elements added to the tin solder matrix have been investigated.
Shaoan Wang, Xiangyu Chen, Keyu Luo, Hongzhi Zhou, Rongqing Li, Peng He, Kyung-Wook Paik, Shuye Zhang   +7 more
doaj   +1 more source

Dynamic properties of solders and solder joints

Journal de Physique IV (Proceedings), 2003
The high strain rate mechanical properties have been measured for three types of solder: 63% Sn 37%Pb, 96.5Sn 3.5 Ag and 95.5Sn 3.8Ag 0.7Cu. Bulk properties were measured using a split Hopkinson pressure bar (SHPB) at strain rates from 500 to 3000 s -1 . A novel method has been designed and used to measure the shear strength of solder joints at low and
Siviour, C, Williamson, D, Palmer, S, Walley, S, Proud, W, Field, J   +5 more
openaire   +2 more sources

Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB) [PDF]

, 2020
Ball grid array (BGA) packages have increasing applications in mobile phones, disk drives, LC displays and automotive engine controllers. However, the thermo-mechanical reliability of the BGA solder joints challenges the device functionality amidst ...
MALLIK, SABUJ, DEPIVER, JOSHUA A., Sabuj, Mallik, Amalu, Emeka H, Depiver, Joshua Adeniyi, Amalu, Emeka; id_orcid   +5 more
core   +1 more source

Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions

, 2021
As temperature cycling drives fatigue failure of solder joints in electronic modules, characterisation of the thermal fatigue response of different solder alloy formulations in BGA solder joints functioning in mission-critical systems has become crucial.
MALLIK, SABUJ, DEPIVER, JOSHUA A., Sabuj, Mallik, Amalu, Emeka H, Amalu, Emeka H., Depiver, Joshua Adeniyi, Amalu, Emeka; id_orcid   +6 more
core   +1 more source

Residual Stress Testing and Simulation Analysis of Crystal Structures of Electronic Device Materials

Crystals, 2023
In this paper, we analyze the residual stress of different components of the crystal structures of electronic device materials following exposure to elevated temperatures using a combination of experimental tests and finite element simulations.
Ming Chen, Jiasheng Li, Wei Su, Zhenhua Nie, Butian Zhong, Xianshan Dong   +5 more
doaj   +1 more source

Comprehensive Properties of a Novel Quaternary Sn-Bi-Sb-Ag Solder: Wettability, Interfacial Structure and Mechanical Properties

Metals, 2019
Sn-58Bi eutectic solder is the most recommended low temperature Pb-free solder but is also limited from the interfacial embrittlement of Bi segregation. Since the quaternary Sn-38Bi-1.5Sb-0.7Ag solder provides a similar melting point as Sn-58Bi eutectic,
Kaipeng Wang, Fengjiang Wang, Ying Huang, Kai Qi   +3 more
doaj   +1 more source

Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment

Crystals, 2021
In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were
Lu Liu, Songbai Xue, Ruiyang Ni, Peng Zhang, Jie Wu   +4 more
doaj   +1 more source

Reliability Examinations of SAC Lead Free Solder Material [PDF]

Archives of Metallurgy and Materials, 2019
In this paper the effect of soldering technique and thermal shock test were investigated on SAC 305 solder joints, produced by two different solder method.
D. Koncz-Horváth, G. Gergely, Z. Gyökér, Z. Gácsi   +3 more
doaj   +1 more source