Results 21 to 30 of about 2,422,228 (271)

Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method

Advances in Materials Science and Engineering, 2020
In this study, “Concentrated Solar Energy (CSE)” is applied for soldering and is named as the “Concentrated Solar Energy Soldering (CSES) technique.” Lead-free solders are used for comparing novel CSES technique solder joints with CSI (Conventional ...
Pushkaraj D. Sonawane, V. K. Bupesh Raja, Manoj Gupta   +2 more
doaj   +1 more source

Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications [PDF]

, 2021
Electronic manufacturing is one of the dynamic industries in the world in terms of leading technological advancements. Electronic assembly's heart lies the 'soldering technology' and the 'solder joints' between electronic components andsubstrate.
Joshua A. Depiver, Yiling Lu, Mallik, Sabuj, Emeka H. Amalu, Sabuj, Mallik, Amalu, Emeka H, Lu, Yiling, Sabuj Mallik, Depiver, Joshua Adeniyi, Amalu, Emeka H.; id_orcid, Depiver, Joshua A.   +10 more
core   +1 more source

Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure

Chinese Journal of Mechanical Engineering, 2021
The thermo-mechanical reliability of IMCs (Ni3Sn4, Cu3Sn, Cu6Sn5) solder joints and Sn-3.9Ag-0.6Cu solder joints was investigated systematically in 3D chip stacking structure subjected to an accelerated thermal cyclic loading based on finite element ...
Liang Zhang, Weimin Long, Sujuan Zhong
doaj   +1 more source

The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates

Journal of Materials Research and Technology, 2023
The preparation of new solder joint materials for chip packaging by designing a variety of brazing material mixes has become one of the future research directions for solder joints. They added low melting point elements to traditional solder materials to
Shuye Zhang, Shaoan Wang, Shang Zhang, Xiangyu Chen, Chen Zeng, Kyung-Wook Paik, Peng He   +6 more
doaj   +1 more source

The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface

Journal of Materials Research and Technology, 2023
In recent years, in order to adapt to the trend of low-temperature assembly and integration, low-temperature hybrid solders with multiple elements added to the tin solder matrix have been investigated.
Shaoan Wang, Xiangyu Chen, Keyu Luo, Hongzhi Zhou, Rongqing Li, Peng He, Kyung-Wook Paik, Shuye Zhang   +7 more
doaj   +1 more source

Residual Stress Testing and Simulation Analysis of Crystal Structures of Electronic Device Materials

Crystals, 2023
In this paper, we analyze the residual stress of different components of the crystal structures of electronic device materials following exposure to elevated temperatures using a combination of experimental tests and finite element simulations.
Ming Chen, Jiasheng Li, Wei Su, Zhenhua Nie, Butian Zhong, Xianshan Dong   +5 more
doaj   +1 more source

Comprehensive Properties of a Novel Quaternary Sn-Bi-Sb-Ag Solder: Wettability, Interfacial Structure and Mechanical Properties

Metals, 2019
Sn-58Bi eutectic solder is the most recommended low temperature Pb-free solder but is also limited from the interfacial embrittlement of Bi segregation. Since the quaternary Sn-38Bi-1.5Sb-0.7Ag solder provides a similar melting point as Sn-58Bi eutectic,
Kaipeng Wang, Fengjiang Wang, Ying Huang, Kai Qi   +3 more
doaj   +1 more source

Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment

Crystals, 2021
In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were
Lu Liu, Songbai Xue, Ruiyang Ni, Peng Zhang, Jie Wu   +4 more
doaj   +1 more source

New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints

, 2020
The continuous improvement of electronic device performances and the advancement of packaging technology have brought greater challenges to the reliability of solder joints in integrated circuits (ICs). In view of the increase of chip integration and the
Peng Zhang, S. Xue, Jian-Hao Wang
semanticscholar   +1 more source

Soldered joints of piezoelectric products

LAPLAGE EM REVISTA, 2020
The paper considers issues related to the use of capillary luminescent flaw detection for monitoring glass-metal soldered joints of piezoelectric products. Standard methods of leakproofness testing of piezoelectric products are analysed; the framework for the applicability of each of them at the stages of the life cycle of piezoelectric products is ...
Olga E. Zheleznikova, Svetlana A. Mikaeva   +1 more
openaire   +3 more sources