Results 21 to 30 of about 7,263 (261)

Solder joint failures under thermo-mechanical loading conditions – a review [PDF]

, 2020
Solder joints play a critical role in electronic devices by providing electrical, mechanical and thermal interconnections. These miniature joints are also the weakest links in an electronic device.
Mallik, Sabuj, Depiver, Joshua Adeniyi, Harmanto, Dani, Depiver, Joshua a   +3 more
core   +1 more source

Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging

Applied Sciences, 2019
With the miniaturization of electronic packaging and devices, the size of solder joints in electronics is also decreasing from bulk solder joints to micro-bumps.
Shaobin Wang, Yao Yao, Xu Long
doaj   +1 more source

Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder joints

Journal of Materials Research and Technology, 2023
The effect of SiC nano-phases (nano-particles and nano-fibers) addition into SAC0307 solder paste was investigated on the thermal and microstructural properties of the composite solder joints.
Agata Skwarek, Balázs Illés, Paweł Górecki, Adrian Pietruszka, Jacek Tarasiuk, Tamás Hurtony   +5 more
doaj   +1 more source

Implicit integration scheme for porous viscoplastic potential-based constitutive equations [PDF]

, 2011
This paper deals with a viscoplastic potential-based model allowing thermomechanical damage behavior modeling of porous materials. The model describes rate dependent effects, hardening, creep as well as defects coalescence and propagation.
Msolli, S., Msolli, Sabeur, Karama, Moussa, M. Karama, Alexis, Joël, J. Alexis, O. Dalverny, Dalverny, O., Alexis, J., Dalverny, Olivier, Karama, M., S. Msolli   +11 more
core   +1 more source

Effects of reflow profile and miniaturisation on integrity of solder joints in surface mount chip resistor

, 2023
Integrity of solder joints of components in an electronic device is critical to the device reliability. Miniaturisation manufacturing trend in electronic products development has continued to challenge the shear strength of the solder joints in these ...
Eugene A. Ogbodo, Njoku, Jude E., Emeka H. Amalu, Ekere, Ndy, Ekpu, Mathias, Amalu, E. H., Ogbodo, Eugene A., Mallik, S., Ekpu, M., Jude E. Njoku, Ndy Ekere, Mallik, Sabuj, Amalu, Emeka H., Njoku, J. E., Ekere, N., Ogbodo, E. A., Sabuj Mallik, Mathias Ekpu, Amalu, Emeka H.; id_orcid   +18 more
core   +1 more source

Creep Properties Assessment by Shear Punch Creep Test and IMC Morphology of Aged Pb-Free Solder Joint/UBM

Metals, 2019
In this paper, we investigated the intermetallic compound (IMC) morphology of aged (0, 200, 600 h) conventional Sn-37Pb and Pb-free Sn-4Ag-0.5Cu solder joints/(Ni-P/Au) UBM; the creep properties of the solder joints were evaluated using a shear punch ...
Sophal Hai, Hyo-Sun Yu
doaj   +1 more source

Electrochemical migration of lead free solder joints

, 2022
S.229-241Electrochemical migration (ECM) tests on lead bearing and lead free solder joints on Cu lamination on FR-4 board were conducted by applying constant voltage.
Schmitt, E., Jillek, W., Yu, D.Q.
core   +1 more source

Effect of nano-Cr particles on solder joint properties of Sn-Zn-Bi-In/Cu brazing

Cailiao gongcheng, 2021
The new composite solder Sn-5Zn-10Bi-10In-xCr (x=0%, 0.1%, 0.3%, 0.5%, mass fraction) was made by adding different contents of nano-Cr particles to the Sn-Zn-Bi-In solder. The effect of nano-Cr particles on the microstructure, element distribution, phase
LIU Guang-zhu, YUE Di, KANG Yu, XIE Hong-yu, HE Ding-jin   +4 more
doaj   +1 more source

Thermo-mechanical reliability studies of lead-free solder interconnects [PDF]

, 2021
Solder interconnections, also known as solder joints, are the weakest link in electronics packaging. Reliability of these miniature joints is of utmost interest - especially in safety-critical applications in the automotive, medical, aerospace, power ...
Depiver, Joshua Adeniyi
core  

Microstructures, mechanical properties and reliability induced from size effect in Sn-based solder joints: Review

Journal of Materials Research and Technology
With the continuous advancement of integrated packaging technology, the dimensions of Sn-based interconnected joints are being steadily reduced. It is necessary to investigate the dependability of Sn-based solder joints with various size since the change
Sijin Li, Xiaowei Wang, Mingqing Liao, Zezheng Li, Qi Li, Han Yan, Aidong Liu, Fengjiang Wang   +7 more
doaj   +1 more source