Results 1 to 10 of about 7,263 (261)

Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling [PDF]

Scientific Reports, 2021
Through ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and − 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the ...
Jianguo Cui, Keke Zhang, Di Zhao, Yibo Pan   +3 more
doaj   +2 more sources

Microstructural and mechanical responses of Sn58Bi/Cu composite solder joints with 0.1wt.% Ni and carbon fiber addition [PDF]

Scientific Reports
The effect of carbon fibers (Cf) and Ni nanoparticles addition on the melting point, microstructure, shear strength, indentation hardness and indentation creep of SnBi58/Cu solder joints were explored.
Xiangxia Kong, Zuchen Liu, Ruipeng Ma, Junjun Zhai, Zhen Pan, Xuemei Li, Fenglian Sun   +6 more
doaj   +2 more sources

Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model [PDF]

Scientific Reports, 2023
Reliability of the microelectronic interconnection materials for electronic packages has a significant impact on the fatigue properties of the electronic assemblies.
Dania Bani Hani, Raed Al Athamneh, Mohammed Abueed, Sa’d Hamasha   +3 more
doaj   +2 more sources

Non-destructive orientation tracking of individual β-Sn grains in die-attach solder joints [PDF]

Journal of Synchrotron Radiation
Understanding the failure mechanisms of Pb-free solder joints during thermal cycling is a critical issue in electronic packaging, where solder joints strongly influence device reliability and lifetime.
Jaemyung Kim, Yujiro Hayashi, Hiroaki Tatsumi, Hiroshi Nishikawa, Makina Yabashi   +4 more
doaj   +2 more sources

Reliability issues of lead-free solder joints in electronic devices [PDF]

Science and Technology of Advanced Materials, 2019
Electronic products are evolving towards miniaturization, high integration, and multi-function, which undoubtedly puts forward higher requirements for the reliability of solder joints in electronic packaging.
Nan Jiang, Liang Zhang, Zhi-Quan Liu, Lei Sun, Wei-Min Long, Peng He, Ming-Yue Xiong, Meng Zhao   +7 more
doaj   +2 more sources

Comparison between bulk and particle solder alloy on the performance of low-melting solder joints

Journal of Materials Research and Technology, 2023
The influence of uniformity and small size solder particles on microstructure evolution and mechanical performances of low temperature soldering joints was investigated.
Mingkun Yang, Xiuchen Zhao, Yongjun Huo, King-Ning Tu, Yingxia Liu   +4 more
doaj   +1 more source

Board Level Drop Test for Evaluating the Reliability of High-Strength Sn–Bi Composite Solder Pastes with Thermosetting Epoxy

Crystals, 2022
The Sn–Bi solder paste is commonly used in electronic assembly and packaging, but its brittleness causes poor reliability in shock environments. In this study, the mechanical reliability of Sn–Bi solder paste and Sn–Bi composite solder paste with ...
Lu Liu, Songbai Xue, Ruiyang Ni, Peng Zhang   +3 more
doaj   +1 more source

Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method

Advances in Materials Science and Engineering, 2020
In this study, “Concentrated Solar Energy (CSE)” is applied for soldering and is named as the “Concentrated Solar Energy Soldering (CSES) technique.” Lead-free solders are used for comparing novel CSES technique solder joints with CSI (Conventional ...
Pushkaraj D. Sonawane, V. K. Bupesh Raja, Manoj Gupta   +2 more
doaj   +1 more source

Soldered joints of piezoelectric products

LAPLAGE EM REVISTA, 2020
The paper considers issues related to the use of capillary luminescent flaw detection for monitoring glass-metal soldered joints of piezoelectric products. Standard methods of leakproofness testing of piezoelectric products are analysed; the framework for the applicability of each of them at the stages of the life cycle of piezoelectric products is ...
Olga E. Zheleznikova, Svetlana A. Mikaeva   +1 more
openaire   +3 more sources

Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure

Chinese Journal of Mechanical Engineering, 2021
The thermo-mechanical reliability of IMCs (Ni3Sn4, Cu3Sn, Cu6Sn5) solder joints and Sn-3.9Ag-0.6Cu solder joints was investigated systematically in 3D chip stacking structure subjected to an accelerated thermal cyclic loading based on finite element ...
Liang Zhang, Weimin Long, Sujuan Zhong
doaj   +1 more source