Reliability issues of lead-free solder joints in electronic devices [PDF]
Science and Technology of Advanced Materials, 2019 Electronic products are evolving towards miniaturization, high integration, and multi-function, which undoubtedly puts forward higher requirements for the reliability of solder joints in electronic packaging.
Nan Jiang +7 more
doaj +3 more sources
The role of microstructure in the thermal fatigue of solder joints. [PDF]
Nat Commun, 2023 Thermal fatigue is a common failure mode in electronic solder joints, yet the role of microstructure is incompletely understood. Here, we quantify the evolution of microstructure and damage in Sn-3Ag-0.5Cu joints throughout a ball grid array (BGA ...
Xian JW +5 more
europepmc +3 more sources
A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints [PDF]
International Journal of Plasticity, 2022 This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu (wt%, SAC305) solder joints of a Ball Grid Array (BGA) board assembly subject to thermal ...
Stoyan Stoyanov +2 more
exaly +2 more sources
Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review. [PDF]
Materials (Basel), 2022 Recently, research into the factors that influence the formation and growth of intermetallic compounds (IMCs) layer in lead-free solders has piqued interest, as IMCs play an important role in solder joints. The reliability of solder joints is critical to
Ramli MII +7 more
europepmc +2 more sources
Thermal Fatigue Failure of Micro-Solder Joints in Electronic Packaging Devices: A Review. [PDF]
Materials (Basel)In electronic packaging products in the service process, the solder joints experience thermal fatigue due to temperature cycles, which have a significant influence on the performance of electronic products and the reliability of solder joints.
Li L, Du X, Chen J, Wu Y.
europepmc +2 more sources
Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling [PDF]
Scientific Reports, 2021 Through ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and − 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the ...
Jianguo Cui +3 more
doaj +2 more sources
Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics. [PDF]
Sci Rep, 2020 The quantity and variety of parameters involved in the failure evolutions in solder joints under a thermo-mechanical process directs the reliability assessment of electronic devices to be frustratingly slow and expensive.
Samavatian V +4 more
europepmc +2 more sources
Microstructural and mechanical responses of Sn58Bi/Cu composite solder joints with 0.1wt.% Ni and carbon fiber addition [PDF]
Scientific ReportsThe effect of carbon fibers (Cf) and Ni nanoparticles addition on the melting point, microstructure, shear strength, indentation hardness and indentation creep of SnBi58/Cu solder joints were explored.
Xiangxia Kong +6 more
doaj +2 more sources
Applied Sciences, 2019 With the miniaturization of electronic packaging and devices, the size of solder joints in electronics is also decreasing from bulk solder joints to micro-bumps.
Shaobin Wang, Yao Yao, Xu Long
doaj +2 more sources
Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model [PDF]
Scientific Reports, 2023 Reliability of the microelectronic interconnection materials for electronic packages has a significant impact on the fatigue properties of the electronic assemblies.
Dania Bani Hani +3 more
doaj +2 more sources