Results 101 to 110 of about 7,263 (261)

Tailoring Model‐Based Systems Engineering for Sub‐100 g PlanarSats: A Power‐First View Stack

Systems Engineering, EarlyView.
ABSTRACT This paper addresses how to apply model‐based systems engineering (MBSE) to ultrasmall planar satellites under severe power and resource constraints. PlanarSats are sub‐100‐gram spacecraft built as single printed‐circuit boards where the same surface must host both electronics and solar cells, so power generation, geometry, and component ...
Mehmet Şevket Uludaǧ, Alim Rüstem Aslan   +1 more
wiley   +1 more source

Voids in Solder Joints

, 2016
Předkládaná bakalářská práce je zaměřena na řešení vzniku dutin v bezolovnatých pájených spojích. Teoretická část se zabývá problematikou bezolovnatého pájení, složením a vlastnostmi nejpoužívanějších bezolovnatých pájecích slitin.
Kouba, Ondřej
core  

‘Fine Men from Afar’: Cricket and Empire on the Home Front

History, EarlyView.
Abstract During the Second World War, contrary to enduring images of bombardment and scarcity, people on Britain's ‘Home Front’ continued to take part in a broad array of sporting activities. Cricket played a more significant role in the wartime sporting landscape than many historians have previously recognized.
Michael Collins
wiley   +1 more source

Organisational dehumanisation: Authority as remedy

European Management Review, EarlyView.
Abstract According to orthodoxy, the human relations movement was a watershed in rehumanising scientifically managed workplaces. In the wake of such purported reform, pundits (theorists and practitioners alike) have typically taken for granted that 21st century approaches to workplace superintendence, birthed in the wake of the Hawthorne Studies and ...
Jean‐Etienne Joullié, Anthony M. Gould, Jeffrey Muldoon   +2 more
wiley   +1 more source

Automatic surface mount solder joints inspection

, 1992
This thesis reports the research results on automatic inspection of solder joints on printed circuit boards. The previous work on this subject has been advanced significantly in the following three aspects.
Liu, Zhu
core  

Mechanical Properties of Flip-Chip Solder Joints Effected by Electromigration

, 2011
A frequent cause of failure of portable and hand-held devices is an accidental drop to the ground. The effect of electromigration on the mechanical properties of solder joints was discussed in this paper.
Ming Wan, Xin Wang, Yu Dong Lu, Xiao Qi He, Yun Fei En   +4 more
core   +1 more source

Design and Implementation of Comparative Accelerated Life Test for Solder Joints Based on Failure Mechanism

机车电传动, 2020
In order to solve the shortcomings of traditional accelerated life test, such as long test time and large sample size, it is necessary to design comparative accelerated life test.
Fan YANG
doaj  

Between Steel and Skin: Corporeal Colonization of Women Workers and Gendered Organizations in Heavy Industry

Gender, Work &Organization, EarlyView.
ABSTRACT “I felt as if my body was being occupied by the factory.” The words of one woman working in Turkey's heavy industry were repeated in many accounts, capturing how industrial infrastructures calibrated to male norms press directly into women's bodies.
Esra Kasap, Janset Özen‐Aytemur, Cihat Erbil   +2 more
wiley   +1 more source

Interfacial reactions and mechanical properties of ball-grid-array solder joints using Cu-cored solder balls

, 2014
Interfacial reactions and mechanical properties of the ball-grid-array (BGA) solder joints using monolithic eutectic SnPb and Cu-cored solder balls after reflow and solid-state annealing were investigated.
陳志銘, Chen, C.M., Lin, H.C.
core   +1 more source

Prediction of mechanical properties and fatigue life of nanosilver slurry in chip interconnection

AIP Advances
This article investigates the failure mode and mechanism of copper pillar solder joints in temperature cycling experiments, focusing on a Cu/nano Ag/Cu solder joint structure.
Hui Yang, Shuai Cheng
doaj   +1 more source