Material Behavior of Mixed Formulation Solder Joints
, 2009 The transition from tin-lead to lead free soldering in the electronics manufacturing industry has been in progress for the past 10 years. In the interim period before lead free assemblies are uniformly accepted, mixed formulation solder joints are ...
Michael J. Bozack +4 more
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Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints. [PDF]
Materials (Basel), 2023 Zhang C, Zhang K, Gao Y, Wang Y.
europepmc +1 more source
Thermal fatigue-life prediction of lead-free solder joints
, 2004 Reliability of lead-free solder joints is investigated. Emphasis is placed on the design for reliability (DFR) of lead-free solder joints. In particular, the thermal-fatigue life of the lead-free solder joints of a plastic ball grid array (PBGA) package ...
Shangguan, Dongkai +2 more
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Influence of Humidity on Voids Formation Inside the Solder Joint [PDF]
, 2013 Void is defined such as blow hole in the solder joint. Voids may degrade the mechanical and conductive properties of the solder joint and thus decrease the reliability. Article deals with influence of humidity on voids formation inside the solder joint
Žák, P. +4 more
core
The effects of vibration on defective solder joints [PDF]
Vibration testing is important in electronics to predict how different components and solder joints behave under stress. In different operating environments, such as vehicles and machines, electronics are exposed to vibration.
Kaltz, Emilia
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Analysis and Modeling of Aged SAC-Bi Solder Joints Subjected to Varying Stress Cycling Conditions. [PDF]
Materials (Basel), 2023 Jian M +6 more
europepmc +1 more source
Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints. [PDF]
Materials (Basel), 2022 Shen YA, Wu JA.
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Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints. [PDF]
Materials (Basel), 2022 Hsu PN +5 more
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Hanjie xuebaoTo address the issues of low reliability of ball grid array (BGA) solder joints under combined effect of mechanical loading from heat sinks and thermal cycling loads, with unclear influencing factors from heat sink mechanical loading, a finite element ...
Wenlong LENG +4 more
doaj +1 more source
Effects of Voids on Thermal Fatigue Reliability of Solder Joints on Inner Rings in Ball Grid Array Packaging by Finite Element Analysis. [PDF]
Micromachines (Basel), 2023 Hu X, Liu L, Liu S, Ruan M, Chen Z.
europepmc +1 more source