Results 131 to 140 of about 7,263 (261)

Research of the reliability of lead-free solder joints

, 2011
This work deals research of the reliability of leed-free solder joints. It summarizes the basic knowledge of lead-free solder alloys, soldering and testing process, the soldered joints.
Pelc, Miroslav
core   +1 more source

Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints. [PDF]

Materials (Basel), 2022
Chen D, Qin J, Zhang X, Liang D, Bai H, Yi J, Yan J.   +6 more
europepmc   +1 more source

Al–Cu Composite Casting of Laser‐Deoxidized Copper: Bonding, Interfacial Chemistry, and Thermal Conductivity

Advanced Engineering Materials, Volume 28, Issue 12, 17 June 2026.
This study investigates laser‐based oxide removal of Cu inserts in oxygen‐free conditions and examines long‐term oxidation kinetics and surface chemistry under different atmospheres via X‐ray photoelectron spectroscopy. Al–Cu compound casting with differently oxidized surfaces is performed, and intermetallic phase formation, morphology, and thermal ...
Timon Steinhoff, Finn‐Lennard Janthur, Sascha Zimmermann, Sarah Seffer, Jörg Hermsdorf, René Gustus, Ludger Overmeyer, Wolfgang Maus‐Friedrichs, Hans Jürgen Maier, Christian Klose   +9 more
wiley   +1 more source

Reliability of solder joints

, 2013
Předkládaná bakalářská práce je zaměřena na popis problematiky spolehlivosti pájených spojů, požadavky na jejich jakost a zejména na metody užívané k jejich kontrole.
Lomberský, Filip
core  

Microstructural evolution of eutectic Au-Sn solder joints [PDF]

, 2002
Current trends toward miniaturization and the use of lead(Pb)-free solder in electronic packaging present new problems in the reliability of solder joints.
Song, Ho Geon
core  

Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints

, 2017
Sn-Bi solder with different Bi content can realize a low-to-medium-to-high soldering process. To obtain the effect of Bi content in Sn-Bi solder on the microstructure of solder, interfacial behaviors in solder joints with Cu and the joints strength, five
Chao Yan, Ying Huang, Zhijie Zhang, Fengjiang Wang   +3 more
core   +1 more source

Intermetallic compound layer and fatigue crack evolution of Bi-contained Sn-1.0Ag-0.5Cu solder under thermal aging and thermal fatigue

Journal of Materials Research and Technology
The Sn-1.0Ag-0.5Cu-xBi solder joints with different Bi content were prepared by reflow soldering. The shear strength, intermetallic compound layer, and fatigue evolution in solder joints were then investigated under thermal aging and thermal fatigue ...
Junjie Zhao, Jun Wu, Jiayu Zhang, Mingqin Liao, Fengjiang Wang   +4 more
doaj   +1 more source

Sustainable Photovoltaics: Optimising Material Consumption, Cost and Environmental Performance Through Smart Sustainability Approaches for Crystalline Silicon Solar Photovoltaics

Solar RRL, Volume 10, Issue 11, 15 June 2026.
A sustainability framework shows that photovoltaics can simultaneously improve material security, reduce costs, and improve environmental performance. Updated learning curves reveal declining material intensity and emissions alongside rising energy return on investment, EROI (> 25).
Moonyong Kim, Catherine Chan, Li Wang, Hasret Sahin, Bruno Vicari Stefani, Nathan Chang, Ran Chen, Christian Breyer, Brett Hallam   +8 more
wiley   +1 more source

Influence of Humidity on Voids Formation Inside the Solder Joint

, 2013
Void is defined such as blow hole in the solder joint. Voids may degrade the mechanical and conductive properties of the solder joint and thus decrease the reliability. Article deals with influence of humidity on voids formation inside the solder joint
Žák, P., Dušek, K., Vlach, J., Brejcha, M., Hájková, L.   +4 more
core  

Impact of laminate cracks under solder pads on the fatigue lives of ball grid array solder joints

, 2015
This paper reports how the solder joint fatigue lives of three types of lead free plastic BGA components were affected by cracks formed in the printed PCB laminate during a thermal cycling test.
Wetter, Göran, Tegehall, Per-Erik,, Wetter, Göran,, Tegehall, Per-Erik   +3 more
core   +1 more source