Time-Lapse Imaging of Bismuth Precipitation and Coarsening on the Surface of Sn-Ag-Cu-Bi Solder Joints After Thermal Cycling. [PDF]
J Electron MaterHsieh CL, Coyle RJ, Gourlay CM.
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Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu. [PDF]
Materials (Basel)Li YJ, Yen YW, Chen CM.
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A Review: Solder Joint Cracks at Sn-Bi58 Solder ACFs Joints
, 2019 Shuye Zhang +3 more
openaire +2 more sources
Segmentation of void defects in X-ray images of chip solder joints based on PCB-DeepLabV3 algorithm. [PDF]
Sci RepKong D, Hu X, Gong Z, Zhang D.
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Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling
Microelectronics and reliability, 2018 J. Libot +5 more
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Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding. [PDF]
Materials (Basel)Han S +5 more
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Decreasing Shear Stresses of the Solder Joints for Mechanical and Thermal Loads by Topological Optimization. [PDF]
Materials (Basel), 2020 Awrejcewicz J +5 more
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The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints. [PDF]
Materials (Basel), 2020 Fu X +8 more
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Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fatigue Life of Ball Grid Array Solder Joints under Thermal Cycling and Random Vibration. [PDF]
Materials (Basel)Lee J, Jeong H, Jang G.
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Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints. [PDF]
Nanomaterials (Basel), 2020 Song JM +4 more
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