Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes. [PDF]
Materials (Basel), 2022 Choi H, Kim CL, Sohn Y.
europepmc +1 more source
Effect of Grain Structure and Ni/Au-UBM Layer on Electromigration-Induced Failure Mechanism in Sn-3.0Ag-0.5Cu Solder Joints. [PDF]
Micromachines (Basel), 2022 Zhang Y, Zhang J, Wang Y, Fang Y.
europepmc +1 more source
Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints. [PDF]
J Mater SciHsieh CL, Coyle RJ, Xian JW, Gourlay CM.
europepmc +1 more source
Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow. [PDF]
Materials (Basel), 2022 Zaimi NSM +9 more
europepmc +1 more source
Fabrication and Bonding Strength of Sn-Decorated MWCNT-Reinforced Sn-3.0Ag-0.5Cu Composite Solder Joints: Reflow vs. IPL Soldering. [PDF]
Materials (Basel)Kang D +6 more
europepmc +1 more source
Anand Model and Finite Element Analysis of Sn-0.3Ag-0.7Cu-3Bi Lead-Free Solder Joints in BGA Packages. [PDF]
Materials (Basel)Liu J, Saad AA, Zheng Y, Ji H, Bachok Z.
europepmc +1 more source
Forming high temperature solder joints through liquid phase sintering of solder paste
Eutectic lead-tin has been the solder of choice throughout the history of the electronics industry. Alternatives to this material are now being considered because of environmental concerns, as well as the strength and temperature limitations of eutectic ...
Pfeiffer, Nicole
core +1 more source
Effects of bismuth on the microstructure and crack propagation in Sn-Ag-Cu-Bi solder joints during thermal cycling. [PDF]
J Mater Sci Mater ElectronHsieh CL +4 more
europepmc +1 more source
Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing. [PDF]
Materials (Basel), 2021 Ramli MII +10 more
europepmc +1 more source
Soldering Technology. Reliability of Soldered Joints.
Circuit Technology, 1992 openaire +2 more sources