Results 201 to 210 of about 2,422,228 (271)
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Preceramic and postceramic solder joints
The Journal of Prosthetic Dentistry, 1975This investigation evaluated preceramic and postceramic soldering procedures. Three gap spaces and two soldering methods were evaluated. Wider gaps produced stronger joints. The strongest joints were achieved by using wider gaps and the oven soldering technique.
E H, Stade, M H, Reisbick, J D, Preston
openaire +2 more sources
Effect of CuZnAl particles addition on microstructure of Cu/Sn58Bi/Cu TLP bonding solder joints
Vacuum, 2019In order to reduce the formation of voids in the Cu/Sn58Bi/Cu solder joints during transient liquid phase (TLP) bonding, the effect of CuZnAl particles on microstructure of Cu/SnBi/Cu TLP bonding solder joints was investigated.
Ming-Yue Xiong +4 more
semanticscholar +1 more source
Deformation and damage of a solder–copper joint
Microelectronics Reliability, 2003Reference LMAF-ARTICLE-2003-003doi:10.1016/S0026-2714(03)00303-2View record in Web of Science Record created on 2005-09-14, modified on 2017-05 ...
P. Tropea, Aïssa Mellal, John Botsis
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Failure Mechanism of Die-Attach Solder Joints in IGBT Modules Under Pulse High-Current Power Cycling
IEEE Journal of Emerging and Selected Topics in Power Electronics, 2019Applications under extreme conditions, such as solid circuit breakers and electromagnetic launching systems, are great challenges to semiconductor power devices.
Yong-Le Huang +3 more
semanticscholar +1 more source
IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2019
Machine vision has been widely deployed in many industrial applications. However, the accuracy and maturity level for the inspection of through-hole technology (THT) solder joints have yet to reach its ultimate goal.
C. L. S. C. Fonseka, J. Jayasinghe
semanticscholar +1 more source
Machine vision has been widely deployed in many industrial applications. However, the accuracy and maturity level for the inspection of through-hole technology (THT) solder joints have yet to reach its ultimate goal.
C. L. S. C. Fonseka, J. Jayasinghe
semanticscholar +1 more source
Thermomigration in solder joints
Materials Science and Engineering: R: Reports, 2012Abstract In 3D IC technology, the vertical interconnection consists of through-Si-vias (TSV) and micro solder bumps. The size of the micro-bump is approaching 10 μm, which is the diameter of TSV. Since joule heating is expected to be the most serious issue in 3D IC, heat flux must be conducted away by temperature gradient.
Chih Chen +4 more
openaire +1 more source
Journal of Materials Processing Technology, 2019
A continuous layer of Ni3Sn4 compounds was formed at the Sn-37Pb solder/Ni interface in ball grid array solder joints after reflowing. Au0.5Ni0.5Sn4 compounds were formed between Sn-37Pb solder and Ni3Sn4 layer during thermal shock between -196 °C and ...
Ruyu Tian +3 more
semanticscholar +1 more source
A continuous layer of Ni3Sn4 compounds was formed at the Sn-37Pb solder/Ni interface in ball grid array solder joints after reflowing. Au0.5Ni0.5Sn4 compounds were formed between Sn-37Pb solder and Ni3Sn4 layer during thermal shock between -196 °C and ...
Ruyu Tian +3 more
semanticscholar +1 more source
International Symposium on Microelectronics, 2012
Solder joint arrays were tested under tensile loading to determine the strain-to-failure (ductility) under a wide range of conditions. The trends in ductility with alloy, joint size, pad metallization, and test conditions were quantified and discussed. 63Sn37Pb solder joints showed a significant increase in ductility as applied stress is reduced below ...
Robert Darveaux +2 more
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Solder joint arrays were tested under tensile loading to determine the strain-to-failure (ductility) under a wide range of conditions. The trends in ductility with alloy, joint size, pad metallization, and test conditions were quantified and discussed. 63Sn37Pb solder joints showed a significant increase in ductility as applied stress is reduced below ...
Robert Darveaux +2 more
openaire +1 more source
2011
Solder joint reliability is the ability of solder joints to function under given conditions and to remain in conformance to both mechanical and electrical specifications for a specified period of time (without failing within the intended operating time).
Johan Liu +5 more
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Solder joint reliability is the ability of solder joints to function under given conditions and to remain in conformance to both mechanical and electrical specifications for a specified period of time (without failing within the intended operating time).
Johan Liu +5 more
openaire +1 more source
2020
Being a joint, the mechanical properties are the basis of all solder joint characterization. The mechanical properties crucial for quality of most electronic devices include shear and pull strength, and creep properties [1].
John H. Lau, Ning-Cheng Lee
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Being a joint, the mechanical properties are the basis of all solder joint characterization. The mechanical properties crucial for quality of most electronic devices include shear and pull strength, and creep properties [1].
John H. Lau, Ning-Cheng Lee
openaire +1 more source