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Microstructure and long-term stability of solder joints on nickel-plated aluminium formed during short soldering times. [PDF]
RSC Adv, 2020 De Rose A +4 more
europepmc +1 more source
Microstructure Influence of SACX0307-TiO2 Composite Solder Joints on Thermal Properties of Power LED Assemblies. [PDF]
Materials (Basel), 2020 Skwarek A +4 more
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IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints. [PDF]
Materials (Basel), 2020 Ren N +8 more
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Soldering Technology 6. Reliability of Soldered Joints.
Circuit Technology, 1992 openaire +2 more sources
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Thermomigration in solder joints
Materials Science and Engineering Reports, 2012Abstract In 3D IC technology, the vertical interconnection consists of through-Si-vias (TSV) and micro solder bumps. The size of the micro-bump is approaching 10 μm, which is the diameter of TSV. Since joule heating is expected to be the most serious issue in 3D IC, heat flux must be conducted away by temperature gradient.
Chih Chen, Hsiang-Yao Hsiao, K N Tu
exaly +2 more sources
Electromigration in solder joints and solder lines
JOM, 2002Electromigration may affect the reliability of flip-chip solder joints. Eutectic solder is a two-phase alloy, so its electromigration behavior is different from that in aluminum or copper interconnects. In addition, a flipchip solder joint has a built-in currentcrowding configuration to enhance electromigration failure.
H. Gan, W. J. Choi, G. Xu, K. N. Tu
openaire +1 more source
Solder joints on rustless alloys
The Journal of the American Dental Association, 1959Passivation is a method of restoring the continuity of the oxide film on metal surfaces in order to reduce corrosion. Nickelchromium alloys should be chemically or electrically passivated before these alloys are soldered. Wherever possible, soldered nickel-chromium alloys should be scrubbed mechanically, dried and set aside to be passivated ...
S M, BIEN, H D, AYERS
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Preceramic and postceramic solder joints
The Journal of Prosthetic Dentistry, 1975This investigation evaluated preceramic and postceramic soldering procedures. Three gap spaces and two soldering methods were evaluated. Wider gaps produced stronger joints. The strongest joints were achieved by using wider gaps and the oven soldering technique.
E H, Stade, M H, Reisbick, J D, Preston
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Automatic solder joint inspection
IEEE Transactions on Pattern Analysis and Machine Intelligence, 1988The task of automating the visual inspection of pin-in-hole solder joints is addressed. Two approaches are explored: statistical pattern recognition and expert systems. An objective dimensionality-reduction method is used to enhance the performance of traditional statistical pattern recognition approaches by decorrelating feature data, generating ...
Sandra L. Bartlett +5 more
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International Symposium on Microelectronics, 2012
Solder joint arrays were tested under tensile loading to determine the strain-to-failure (ductility) under a wide range of conditions. The trends in ductility with alloy, joint size, pad metallization, and test conditions were quantified and discussed. 63Sn37Pb solder joints showed a significant increase in ductility as applied stress is reduced below ...
Robert Darveaux +2 more
openaire +1 more source
Solder joint arrays were tested under tensile loading to determine the strain-to-failure (ductility) under a wide range of conditions. The trends in ductility with alloy, joint size, pad metallization, and test conditions were quantified and discussed. 63Sn37Pb solder joints showed a significant increase in ductility as applied stress is reduced below ...
Robert Darveaux +2 more
openaire +1 more source