Results 241 to 250 of about 7,263 (261)

Effects of ZrO2 nanoparticles on the mechanical properties of Sn–Zn solder joints on Au/Ni/Cu pads

Journal of Alloys and Compounds, 2009
Y C Chan
exaly  

The effect of aging on microstructure, room temperature deformation, and fracture of Sn-Bi/Cu solder joints

Journal of Electronic Materials, 1994
D B Knorr, Knorr D B
exaly  

Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints

Materials Science and Engineering B: Solid-State Materials for Advanced Technology, 1998
J K L Lai
exaly  

Defect inspection of flip chip solder joints based on non-destructive methods: A review

Microelectronics Reliability, 2020
Lei Su, Michael Pecht
exaly  

Studies of the mechanical and electrical properties of lead-free solder joints

Journal of Electronic Materials, 2002
S K Kang, Kang S K
exaly  

The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints

Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing, 2013
P Svec, D Janickovic, Yu Plevachuk
exaly  

In situ observations on creep fatigue fracture behavior of Sn–4Ag/Cu solder joints

Acta Materialia, 2011
Q K Zhang
exaly  

Effect of aging on mechanical properties of high temperature Pb-rich solder joints

Microelectronics Reliability, 2018
G Khatibi
exaly  

Thermal fatigue behaviors of Sn–4Ag/Cu solder joints at low strain amplitude

Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing, 2013
Q K Zhang
exaly  

A mechanistic model for fatigue life prediction of solder joints for electronic packages

International Journal of Fatigue, 1997
Soon-Bok Lee
exaly