Results 151 to 160 of about 15,046 (211)

Study of Application of an Active Ultrasound by Use of Zn-Al-Mg-Ti-Based Solder on Selected Substrates. [PDF]

Materials (Basel)
Koleňák R, Meluš T, Drapala J, Gogola P, Pašák M.   +4 more
europepmc   +1 more source

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Solders, Solderable Finishes and Reflowed Solder Coatings

Circuit World, 1977
In the production of printed circuit assemblies, the demand for higher reliability levels has increased over the years. In order to achieve a high level of soldering quality, it is essential that solderability is built into the system at all stages and various factors must be taken into account.
M.L. Ackroyd, C.A. MacKay
openaire   +1 more source

Ultrasonic soldering in electronics [PDF]

Ultrasonics Sonochemistry, 2001
Ultrasonic (US) soldering of electronic components, as an alternative to flux soldering, is environmentally friendly, improves the quality of soldered connections at the mounting elements after long-term storage, and allows to use lead-free solders ...
V L Lanin
exaly   +1 more source

Solderability and reliability evolution of no clean solder fluxes for selective soldering

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017
Abstract Flux consumption for wave soldering tends to decrease, mainly due to its gradual replacement by reflow soldering methods (i.e. pin-in-paste) in many electronics applications. However, in several cases, wave soldering still remains a must, with an increasing share of “selective” soldering processes, either using wave frames with ...
Emmanuelle Guéné, Richard Anisko, Céline Puechagut   +2 more
openaire   +2 more sources

SOLDERING WITH DUCTILE ACTIVE SOLDERS

Materials and Manufacturing Processes, 2001
Ductile active solders enable production of the vacuum-tight joints of metals with such brittle nonmetallic materials as quartz, ceramics, silicon, and carbon. This article describes the techniques of the preparation of solders and the examples of the practical application of joints in the vacuum and cryogenic devices.
Jan Dupák, Vladimír Ustohal
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Solder man

ACM SIGGRAPH 2003 video review on Animation theater program: part 1 - Volume 145, 2003
A story of creation, evolution and problem solving. After experiencing a problem with his creation, solder man looks to solve his dilemma the only way that he knows how, by soldering. With great effort he is successful, but finds himself in much worse shape.
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Solder bumping through Super Solder

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future', 2002
Flip chip mounting technology is currently being considered for use in consumer information equipment, and industry is waiting for the establishment of solder bump forming technology as an essential constituent of flip chip (FC) mounting technology. At the present, however, no bump forming technology offers a combination of simple process and low cost.
Y. Kaga, T. Amano, M. Kohno, Y. Obara
openaire   +1 more source