Results 271 to 280 of about 982,626 (335)

MYELOMA OF THE SPINE

open access: green, 1928
Donald C. Durman
openalex   +2 more sources

3D Printing for Neural Repair: Bridging the Gap in Regenerative Medicine

open access: yesAdvanced Materials, EarlyView.
This perspective article discusses how 3D bioprinting is advancing the development of neural tissue models and implants. It highlights recent progress in fabricating complex, multicellular neural constructs, examines current technical barriers, and outlines future applications in disease modeling, neurotoxicity testing, and regenerative therapies ...
Mitchell St Clair‐Glover   +2 more
wiley   +1 more source

What\u27s new in spine surgery [PDF]

open access: yes, 2003
Anderson, Paul A.   +4 more
core   +2 more sources

Carbon Quantum Dots Assisted Virus Tracking: From Skin to Brain

open access: yesAdvanced Materials, EarlyView.
A novel carbon quantum dots‐dissolvable microneedle, CQDs‐dMN system, enables painless delivery and real‐time tracking of HSV‐1. The HSV‐1 is labeled with fluorescent CQDs and delivered to the skin dermis, minimizing damage compared to traditional methods.
Yaxiu Feng   +11 more
wiley   +1 more source

Playing Hard with Si: Challenges and Opportunities for New Materials in Radiation Therapy Dosimetry

open access: yesAdvanced Materials, EarlyView.
Silicon has been a cornerstone material of radiation therapy dosimetry for many decades, providing somewhat unchallenged performance. However, there are caveats to its use, requiring complex designs and, often, correction factors to provide accurate measurements.
James Cayley   +9 more
wiley   +1 more source

Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya   +3 more
wiley   +1 more source

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