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Oxidation-Tuned CuO<sub><i>x</i></sub> for Spin-Orbit Torque Efficiency Enhancement. [PDF]
ACS Appl Mater InterfacesLi CJ, Pai CF.
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Controlling Vertical Diffusion with an Al<sub>2</sub>O<sub>3</sub> Back Interface Layer for Stable High-Performance InZnO TFTs. [PDF]
ACS OmegaLee SH +7 more
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Magnetron sputtering enabled sustainable synthesis of nanomaterials for energy electrocatalysis
, 2021Next-generation energy technologies have captured increasing research interest because of their fascinating advantages, yet the implementation of such technologies requires efficient and robust electrocatalysts to overcome the sluggish heart reaction ...
Jie Liang +8 more
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Philosophical Transactions of the Royal Society of London. Series A: Mathematical, Physical and Engineering Sciences, 2003
The potential energy stored in multiply charged ions is liberated when the ions recombine during impact on a solid surface. For certain target species this can lead to a novel form of ion-induced sputtering, which, in analogy to the usual kinetic sputtering, has been termed 'potential sputtering'.
Friedrich, Aumayr, Hannspeter, Winter
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The potential energy stored in multiply charged ions is liberated when the ions recombine during impact on a solid surface. For certain target species this can lead to a novel form of ion-induced sputtering, which, in analogy to the usual kinetic sputtering, has been termed 'potential sputtering'.
Friedrich, Aumayr, Hannspeter, Winter
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Tutorial: Hysteresis during the reactive magnetron sputtering process
Journal of Applied Physics, 2018Reactive magnetron sputtering is a well-established physical vapor technique to deposit thin compound films on different substrates, ranging from insulating glass windows over wear-resistant car parts to high-responsive touch screens.
K. Strijckmans, R. Schelfhout, D. Depla
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Journal of Ultrastructure Research, 1984
A device has been constructed which allows specimens to be shadowed in a conventional sputter water. This process of sputter shadowing lends to specimens a contrast suitable for imaging in the transmission electron microscope (TEM). The process has the practical advantages over metal evaporation shadowing of lower instrumentation costs, less user ...
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A device has been constructed which allows specimens to be shadowed in a conventional sputter water. This process of sputter shadowing lends to specimens a contrast suitable for imaging in the transmission electron microscope (TEM). The process has the practical advantages over metal evaporation shadowing of lower instrumentation costs, less user ...
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2022
"Sputter" lyrically divulges the turbulence and emotional upheaval of queer youth, documenting the complicated nature of adolescence, transformation, age, sex and generational trauma.
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"Sputter" lyrically divulges the turbulence and emotional upheaval of queer youth, documenting the complicated nature of adolescence, transformation, age, sex and generational trauma.
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Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 1988
Abstract The statistics of the emission of sputtered particles is investigated with the Monte Carlo program TRIM SP. The probability of sputtering N atoms with N ≧ 0 per single projectile is determined for a wide range of projectile target combinations (mass ratio), incident ion energies and angles.
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Abstract The statistics of the emission of sputtered particles is investigated with the Monte Carlo program TRIM SP. The probability of sputtering N atoms with N ≧ 0 per single projectile is determined for a wide range of projectile target combinations (mass ratio), incident ion energies and angles.
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Journal of Vacuum Science and Technology, 1978
The technology is reviewed with emphasis on implementation. PM sputtering is characterized by cathode potentials of 300–700 V and sputtering gas pressures of 1-15 mTorr (0.1–2 Pa). Deposition rates are proportional to power density, which in turn is primarily limited by the thermal conductivity and cooling efficiency of the target.
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The technology is reviewed with emphasis on implementation. PM sputtering is characterized by cathode potentials of 300–700 V and sputtering gas pressures of 1-15 mTorr (0.1–2 Pa). Deposition rates are proportional to power density, which in turn is primarily limited by the thermal conductivity and cooling efficiency of the target.
openaire +1 more source