Results 121 to 130 of about 20,823 (293)
This work establishes a framework for high‐resolution printed interconnects by coupling e‐jet printing control, multilayer deposition, and sintering optimization. Ink properties and printing speed influence particle stacking, while different sintering atmospheres drive distinct microstructural evolution.
Kaifan Yue +6 more
wiley +1 more source
Ultra‐Thin Soft Pneumatic Actuation for Minimally Invasive Neural Interfacing
Parylene C is a common polymer in bioelectronics, favored for its biological and chemical inertness. However, this makes bonding layers of Parylene C together very challenging. Here it is a laser to selectively weld layers of Parylene C to create high‐pressure fluidic actuation devices.
Lawrence Coles +4 more
wiley +1 more source
Advanced fiber placement of composite fuselage structures [PDF]
The Hercules/NASA Advanced Composite Technology (ACT) program will demonstrate the low cost potential of the automated fiber placement process. The Hercules fiber placement machine was developed for cost effective production of composite aircraft ...
Anderson, Robert L., Grant, Carroll G.
core +1 more source
Chemically Doped Conductive Polymers for Wearable Health Monitoring
Among conductive polymers, poly(3,4‐ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS), polyaniline (PANI), and polypyrrole (PPy) are the most studied and applied. Chemical doping significantly boosts intrinsic conductivity and mechanical robustness.
Mengdi Zuo +5 more
wiley +1 more source
Development of lightweight aluminum compression panels reinforced by boron-epoxy infiltrated extrusions [PDF]
Analytical and experimental studies were performed to evaluate the structural efficiencies afforded by the selective reinforcement of conventional aluminum compression panels with unidirectional boron epoxy composite materials.
Henshaw, J., Mcelman, J. A., Roy, P. A.
core +1 more source
Adhesive Double‐Network Granular Organogel E‐Skin
We introduce a double‐network granular organogel adhesive for electronic skin, overcoming adhesion and strength trade‐offs. It provides reversible, robust bonding and ionic conductivity, enabling wearable and soft robotic e‐skin. Thanks to the e‐skin adhesive, a soft robotic trunk can recognize touch, temperature, humidity, and acidity.
Antonia Georgopoulou +4 more
wiley +1 more source
Composite transport wing technology development: Design development tests and advanced structural concepts [PDF]
Numerous design concepts, materials, and manufacturing methods were investigated for the covers and spars of a transport box wing. Cover panels and spar segments were fabricated and tested to verify the structural integrity of design concepts and ...
Griffin, Charles F., Harvill, William E.
core +1 more source
Direct Laser Writing of Magnetic Micro Actuators With a Stimulus‐Responsive Compliant Hinge
This study presents a versatile modular design strategy for adaptive 3D microactuators. Using two‐photon‐induced C,H insertion reactions within solid polymer layers, chemically distinct hinge and stimulus responsive materials are patterned in one step. The hinge's properties enable tunable motion, mechanical control, and reconfigurable actuation across
Eleonora Galli +4 more
wiley +1 more source
Determinación del comportamiento bajo cargas concentradas de perfiles de lámina delgada ( MM )
En el campo de la lámina delgada continuamente aparecen nuevos tipos de perfiles que son desarrollados con el objeto de mejorar los ya existentes. Un ejemplo de esto es la aparición del perfil M, elaborado para melorar la eficiencia a corte del perfil C ...
Maritzabel Molina Herrera +1 more
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Stress analysis and buckling of J-stiffened graphite-epoxy panel [PDF]
A graphite epoxy shear panel with bonded on J stiffeners was investigated. The panel, loaded to buckling in a picture frame shear test is described. Two finite element models, each of which included the doubler material bonded to the panel skin under the
Davis, R. C.
core +1 more source

