Results 41 to 50 of about 667 (175)

Ground state solutions for quasilinear Schrödinger equations with variable potential and superlinear reaction

open access: yesRevista Matemática Iberoamericana, 2020
This paper is concerned with the following quasilinear Schrödinger equation: -\Delta u+V(x)u-\frac{1}{2}\Delta (u^2)u= g(u), \quad x\in \mathbb{R}^N, where N\ge 3
Chen, Sitong   +3 more
openaire   +2 more sources

On a logarithmic Hartree equation

open access: yesAdvances in Nonlinear Analysis, 2019
We study the existence of radially symmetric solutions for a nonlinear planar Schrödinger-Poisson system in presence of a superlinear reaction term which doesn’t satisfy the Ambrosetti-Rabinowitz condition. The system is re-written as a nonlinear Hartree
Bernini Federico, Mugnai Dimitri
doaj   +1 more source

Parametric superlinear double phase problems with singular term and critical growth on the boundary [PDF]

open access: yes, 2022
In this paper, we study quasilinear elliptic equations driven by the double phase operator along with a reaction that has a singular and a parametric superlinear term and with a nonlinear Neumann boundary condition of critical growth.
Crespo‐Blanco, Ángel   +2 more
core   +1 more source

Concave-Convex Problems for the Robin p-Laplacian Plus an Indefinite Potential

open access: yesMathematics, 2020
We consider nonlinear Robin problems driven by the p-Laplacian plus an indefinite potential. In the reaction, we have the competing effects of a parametric concave (that is, ( p − 1 ) -sublinear) term and of a convex (that is, ( p −
Nikolaos S. Papageorgiou   +1 more
doaj   +1 more source

Infinite time blow-up for superlinear parabolic problems with localized reaction [PDF]

open access: yesProceedings of the American Mathematical Society, 2004
We consider the nonlocal diffusion equation \[ u t
openaire   +1 more source

A 3D‐Printed Blister Test Platform for Quantifying Biointerface Adhesion Mechanisms

open access: yesAdvanced Materials Interfaces, EarlyView.
A 3D‐printed blister platform enables energy‐resolved characterization of soft hydrogel–rigid interfaces. Integrating precision pressure control with hyperelastic modeling directly quantifies adhesion energy (G) and R‐curve toughening. Results reveal that modulating hydrogel concentration and surface roughness drives a tunable transition from cohesive ...
Yoontae Kim   +4 more
wiley   +1 more source

Twisted MoS2 Bilayers as Functional Elements in Memtransistors: Hysteresis, Optical Signatures, and Photocurrent Kinetics

open access: yesAdvanced Electronic Materials, EarlyView.
ABSTRACT Layered 2D materials are considered as promising for memristive applications due to their ultimate vertical scalability compared to conventional semiconductor films and pronounced hysteresis properties. Bias‐resolved Raman and Photoluminescence mapping is used to quantify strain from phonon shifts and carrier density from the exciton‐trion ...
Vladislav Kurtash   +4 more
wiley   +1 more source

A priori estimates of solutions of superlinear problems [PDF]

open access: yes, 2001
summary:In this survey we consider superlinear parabolic problems which possess both blowing-up and global solutions and we study a priori estimates of global ...
Quittner, Pavol
core   +1 more source

Weak Solutions for a Class of Nonlocal Singular Problems Over the Nehari Manifold

open access: yesMathematical Methods in the Applied Sciences, EarlyView.
ABSTRACT In this paper, we consider a nonlocal model of dilatant non‐Newtonian fluid with a Dirichlet boundary condition. By using the Nehari manifold and fibering map methods, we obtain the existence of at least two weak solutions, with sign information.
Zhenfeng Zhang   +2 more
wiley   +1 more source

In Situ Copper Electroplating Turns Material Extrusion 3D Printers Into Metal–Polymer Hybrid Fabricators

open access: yesAdvanced Materials Technologies, Volume 11, Issue 11, 5 June 2026.
An in situ electroplating approach for MEX 3D printing is proposed, enabling copper deposition during the fabrication of conductive polymers. The method combines a printer‐integrated plating head, ML‐based g‐code control, and stop‐and‐go printing, achieving near‐bulk copper conductivity and enabling fully embedded, assembly‐free electronic components ...
Gianluca Percoco   +5 more
wiley   +1 more source

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