Results 71 to 80 of about 362,217 (292)
This article examines how build orientation, thickness, and loading rate affect the tensile and compressive properties of LS‐manufactured polyamide 12 12 parts. Through over 120 experiments, it reveals strong ductility anisotropy in tension, minimal compressive sensitivity, and significant thickness and strain rate dependencies.
Andreas Psarros +2 more
wiley +1 more source
Electrical and topological properties of oxides films grown thermally on InSe substrates [PDF]
The surface resistance dynamics of oxides grown thermally on InSe substrates in two crystallography planes is obtained. It is determined that resistance changes considerably only during the first 5 minutes of the oxidization period.
Katerynchuk V. M. +2 more
doaj
Magnetic surface topology in decaying plasma knots
Torus-knot solitons have recently been formulated as solutions to the ideal incompressible magnetohydrodynamics (MHD) equations. We investigate numerically how these fields evolve in resistive, compressible, and viscous MHD. We find that certain decaying
C B Smiet +3 more
doaj +1 more source
A continuity property and surface topology [PDF]
Introduction. While studying global properties of spaces of retractions of 2-manifolds, the author was led to a continuity property for conformai mappings of simply connected domains with locally connected boundaries (§1, Theorem 2). Applications are given to the study of spaces of retractions (§2), spaces of retracts (§3), and the Dirichlet problem ...
openaire +4 more sources
Additive manufacturing (AM) transforms space hardware by enabling lightweight, high‐performance, and on‐demand production. This review outlines AM processes—powder bed fusion (PBF), directed energy deposition (DED), binder jetting (BJ), sheet lamination (SL), and material extrusion (ME)—applied to propulsion, satellite structures, and thermal devices ...
Stelios K. Georgantzinos +8 more
wiley +1 more source
In the fabrication of semiconductors, chemical mechanical polishing (CMP) is an essential wafer-planarization process. For optimal CMP, it is crucial to monitor the texture of the polishing pad; this leads to homogenous planarization of wafers. Hence, we
Eun-Soo Kim, Woo-June Choi
doaj +1 more source
This study explores the ablation efficiency and surface quality of laser‐treated stainless steel alloys (AISI 304, AISI 420, and AISI 316Ti) using an ultrashort pulsed laser and varying burst parameters (MHz, GHz, and Bi‐burst). Both ablation rates and surface quality parameters are determined, including isotropy surface roughness values, highlighting ...
Dirk Obergfell +2 more
wiley +1 more source
For the containment control problem of unmanned surface ship systems (USSs) with time delay and limited communication bandwidth, this paper proposes a distributed event-triggered control strategy using a joint connection switching topology.
Binfeng Tang, Yuge Liu, Ying Huang
doaj +1 more source
In layered single band systems, the interlayer conductivity depends on the orientation of the in-plane magnetic field and takes maximum values when the magnetic field is perpendicular to flat regions of the Fermi surface.
Bulaevskii L. N. +25 more
core +1 more source
Linear magnetoresistance on the topological surface [PDF]
7 pages, 4 ...
C. M. Wang, X. L. Lei
openaire +3 more sources

