Results 111 to 120 of about 7,853,994 (328)
BASIS WEIGHT UNIFORMITY OF LIGHTLY NEEDLED HYDROENTANGLED COTTON AND COTTON BLEND WEBS [PDF]
New nonwoven products containing cotton and Lyocell (Trademarked name Tencel), low temperature thermal-bondable bicomponent olefin/polyester, or comber noils were developed using needlepunching and spunlacing (hydroentanglement).
Alfred Watzl +6 more
core
Freeze‐drying of layered silicate is the key to get coatings with superior gas barrier. Freeze‐drying of layered silicates modified with dodecylamine (DDA) is a highly effective technique for the preparation of barrier pigments that significantly mitigate the permeation of oxygen, water vapor, and hydrogen through polymer films containing these ...
Joshua Lommes +4 more
wiley +1 more source
Integrated additional cooling channels offer precise thermal management for solid-oxide fuel cells (SOFCs), mitigating temperature gradients.
Kirttayoth Yeranee, Yuli Cheng, Yu Rao
doaj +1 more source
Thermal Performance of Micro Hotplates with Novel Shapes Based on Single-Layer SiO2 Suspended Film
In this paper, two kinds of suspended micro hotplate with novel shapes of multibeam structure and reticular structure are designed. These designs have a reliable mechanical strength, so they can be designed and fabricated on single-layer SiO2 suspended ...
Qi Liu +3 more
doaj +1 more source
An idea of designing novel sensors is proposed by creating appropriate Schottky barriers and vacancies between isomorphous Core‐CuOii/ Shell‐CuOi secondary microspheres and enhancing catalytic and spill‐over effects, and electronegativity via spontaneous biphasic separation, self‐assembly, and trace‐Ni‐doping.
Bala Ismail Adamu +8 more
wiley +1 more source
Research on Heat Transfer Characteristics of Vapor Chamber Integrated Heat Spreader for Chip Package
The high heat flux and the development of miniaturized chips have restricted the thermal diffusion ability of traditional metal materials. In this study, a vapor chamber with a micro-pin was designed and used in an integrated heat spreader (IHS).
Mao Chunlin +5 more
doaj
A Design Method to Improve Temperature Uniformity on Wafer for Rapid Thermal Processing
Single-wafer rapid thermal processing (RTP) is widely used in semiconductor manufacturing. Achieving temperature uniformity on silicon wafer is a major challenge in RTP control.
Peng Huang, Hongguan Yang
semanticscholar +1 more source
An Inkjet‐Printed Platinum‐Based Temperature Sensing Element on Polyimide Substrates
An inkjet‐printed, meander‐structured, nanoparticle platinum‐based resistive temperature sensors on polyimide substrates are demonstrated as proof‐of‐concept. Optimized sintering at 250°C enables stable conductive structures. The Pt100‐ and Pt1000‐type sensors exhibit linear resistance–temperature characteristics with stable TCR in the 20°C–80°C range,
Shawon Alam +6 more
wiley +1 more source
Evaluation of Temperature Uniformity in a Middle-Refrigerated Truck Loaded with Pig Carcasses. [PDF]
Bai H, Zhou G, Liu X.
europepmc +1 more source
A proper operating temperature range and an acceptable temperature uniformity are extremely essential for the efficient and safe operation of the Li-ion battery array, which is an important power source of space stations.
Hui-Juan Xu +4 more
doaj +1 more source

