Results 71 to 80 of about 1,337 (176)

Molecular Layer Deposited Aluminum‐Based Hybrid Resist for High‐Resolution Nanolithography and Direct Ultra‐High Aspect Ratio Pattern Transfer

Advanced Materials Technologies, Volume 11, Issue 3, 5 February 2026.
This study demonstrates an aluminum‐based hybrid photoresist synthesized via molecular layer deposition (MLD) using trimethylaluminum and hydroquinone. The resist achieves sub‐20 nm resolution and virtually infinite silicon etch selectivity, enabling 40 nm‐wide, micrometer‐tall nanostructures.
Won‐Il Lee, Dan N. Le, Matthew Yen, Melinda Lin, Ashwanth Subramanian, Xiao Tong, Nikhil Tiwale, Jiyoung Kim, Chang‐Yong Nam   +8 more
wiley   +1 more source

Tunable Patterned Blue Phase Liquid Crystals Based on Lithographic Process Technology

Advanced Optical Materials, Volume 14, Issue 6, 9 February 2026.
A patterned blue phase liquid crystal device with electrically driven, localized bistability is demonstrated using a cost‐efficient photolithographic dual‐alignment process. The device switches between a high‐contrast patterned state and a uniform reflective state.
Jia‐Yu Cao, Ting‐Mao Feng, Duan‐Yi Guo, Liang‐Ying Wu, Aleksandra Neumann, Kamil Orzechowski, Chun‐Ta Wang   +6 more
wiley   +1 more source

Manufacture and Characterization of High Q-Factor Inductors Based on CMOS-MEMS Techniques

Sensors, 2011
A high Q-factor (quality-factor) spiral inductor fabricated by the CMOS (complementary metal oxide semiconductor) process and a post-process was investigated. The spiral inductor is manufactured on a silicon substrate.
Ming-Zhi Yang, Jin-Yu Hong, Ching-Liang Dai   +2 more
doaj   +1 more source

Heavily Boron-Doped Silicon Layer for the Fabrication of Nanoscale Thermoelectric Devices

Nanomaterials, 2018
Heavily boron-doped silicon layers and boron etch-stop techniques have been widely used in the fabrication of microelectromechanical systems (MEMS).
Zhe Ma, Yang Liu, Lingxiao Deng, Mingliang Zhang, Shuyuan Zhang, Jing Ma, Peishuai Song, Qing Liu, An Ji, Fuhua Yang, Xiaodong Wang   +10 more
doaj   +1 more source

Spiking test-based evaluation of semiconductor wastewater reuse process under shock-loading conditions: Removal of TMAH and metal(loid) contaminants

Desalination and Water Treatment
Stable treatment performance is essential for semiconductor wastewater reuse systems under shock-loading conditions. This study evaluated the removal behavior of tetramethylammonium hydroxide (TMAH) and selected metal(loid)s in a lab-scale semiconductor ...
Deokhwan Kim, Jonghun Lee, Jeonghoo Sim, Yuying Liu, Byung-Moon Jun, June-Seok Choi, Hojung Rho   +6 more
doaj   +1 more source

Evolution of Si Crystallographic Planes-Etching of Square and Circle Patterns in 25 wt % TMAH

Micromachines, 2019
Squares and circles are basic patterns for most mask designs of silicon microdevices. Evolution of etched Si crystallographic planes defined by square and circle patterns in the masking layer is presented and analyzed in this paper.
Milče M. Smiljanić, Žarko Lazić, Branislav Radjenović, Marija Radmilović-Radjenović, Vesna Jović   +4 more
doaj   +1 more source

PY/GC/MS ANALYSES OF HISTORICAL PAPERS

BioResources, 2008
The thermal degradation of cellulose is an important process in several fields such as the paper industry, biomass combustion, fire retardation, etc. Paper consists mostly of cellulose fibres.
Yeghis Keheyan
doaj  

In situ lignocellulosic unlocking mechanism for carbohydrate hydrolysis in termites: crucial lignin modification

Biotechnology for Biofuels, 2011
Background Termites are highly effective at degrading lignocelluloses, and thus can be used as a model for studying plant cell-wall degradation in biological systems.
Singh Deepak, Laskar Dhrubojyoti D, Ke Jing, Chen Shulin   +3 more
doaj   +1 more source

High channel mobility at SiO2/GaN interface with different tilt angle trench sidewalls formed by wet etching treatment

APL Materials
The development of low-resistance Gallium nitride (GaN) trench metal-oxide semiconductor (MOS) channels is required. Since the trenches are formed by dry etching, their surfaces are inevitably exposed to plasma, leading to plasma-induced damage ...
Hirohisa Hirai, Yoshinao Miura, Akira Nakajima, Shinsuke Harada   +3 more
doaj   +1 more source

Removal of Tetramethylammonium Hydroxide (Tmah) During the Uv-Led/H2o2 Reaction: Degassing Effect, Radical Contribution, and Degradation Mechanism

, 2022
Tae-Kyoung Kim, Kyung‐Duk Zoh
openalex   +1 more source