Results 201 to 210 of about 3,740,932 (397)

Electrical and thermal conductivity of Earth's iron-enriched basal magma ocean. [PDF]

Proc Natl Acad Sci U S A
Dragulet F, Stixrude L.
europepmc   +1 more source

Impact of Structural Adhesive Hybridization Strategy on the Performance of In‐Mold Electronics Devices Across Thermoforming and Injection Molding

Advanced Engineering Materials, EarlyView.
In‐mold electronics (IME) undergo complex thermoforming and over‐molding processes that strain device integrity. This study demonstrates how adapting the amount and placement of structural adhesive to local deformation levels preserves electrical functionality.
Francisco Ituriel Arias‐García, Nekane Lozano‐Hernandez, Maria Lluisa Maspoch, Enric Fontdecaba   +3 more
wiley   +1 more source

Domain-Wall Driven Suppression of Thermal Conductivity in a Ferroelectric Polycrystal. [PDF]

Adv Sci (Weinh)
Belrhiti-Nejjar R, Zahn M, Limelette P, Haas M, Féger L, Monot-Laffez I, Horny N, Meier D, Giovannelli F, Schultheiß J, Nataf GF.   +10 more
europepmc   +1 more source

Surface Modification of Fluorine‐Free Superhydrophobic Materials with (Ultra‐)Thin TiO2 Layers

Advanced Engineering Materials, EarlyView.
Significant changes in wettability, with a reduction of 60o in the water conduct angle, are reported via the surface modification of fluorine‐free superhydrophobic thin films, prepared by aerosol‐assisted chemical vapor deposition, after coating a 4 nm layer of titanium dioxide on the surface using atomic layer deposition.
Julie Jalila Kalmoni, Chris Blackman, Claire J Carmalt   +2 more
wiley   +1 more source

Fractional heat conduction with variable thermal conductivity in rotating hydro-semiconductors. [PDF]

Sci Rep
Elshazly IS, Alshormani F, El Nasr MA, El-Bary AA, Adel M, Jlali L, Lotfy K.   +6 more
europepmc   +1 more source

LV. On the thermal conductivity and diathermancy of air and hydrogen [PDF]

, 1877
H. Buff
openalex   +1 more source

Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction

Advanced Engineering Materials, EarlyView.
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke, John Wu, Alan L. Kastengren, Nikhilesh Chawla   +3 more
wiley   +1 more source

Thermal Conductivity of Suspended Graphene at High Temperature Based on Raman Spectroscopy. [PDF]

Nanomaterials (Basel)
Wang J, Guo Z, Shang Z, Luo F.
europepmc   +1 more source

A note on the relation between the thermal conductivity and the viscosity of gases, with reference to molecular complexity

, 1915
James A. Pollock
openalex   +2 more sources

O. PEIRCE et R. WILLSON. - On the thermal conductivities of certain poor conductors (Sur la conductivité thermique de corps mauvais conducteurs).- Proceed. of the Amer. Acad. of Arts and Science, t. XXXIV; août 1898 [PDF]

, 1899
Ch. Maurain
openalex   +1 more source