Results 111 to 120 of about 5,589,585 (294)

Chemical heterogeneity size effects at nanoscale on interface thermal resistance of solid–liquid polymer interface via molecular dynamics simulations

AIP Advances
The shrinking size of integrated chips poses thermal management challenges. Understanding the size effect of chemical heterogeneity on solid–liquid interfacial thermal transfer is essential for heterogeneous chip design, yet the underlying mechanisms ...
Qing-Yao Luo, Donatas Surblys, Hiroki Matsubara, Taku Ohara   +3 more
doaj   +1 more source

Measurement of the Thermophysical Properties of Anisotropic Insulation Materials with Consideration of the Effect of Thermal Contact Resistance. [PDF]

Materials (Basel), 2020
Han D, Yue K, Cheng L, Yang X, Zhang X.
europepmc   +1 more source

Rotary 3D Printing With Integrated Electroplating

Advanced Engineering Materials, EarlyView.
A rotary material extrusion platform integrates localized copper electroplating with printing and encapsulation to fabricate cylindrical polymer–metal structures containing fully embedded, low‐resistance conductive pathways that enable internal Joule heating and thermally activated shape‐memory responses.
Antonio Zagaria, Nicola Larovere, Moslem Mohammadi, Gianluca Percoco, Ali Zolfagharian, Gianni Stano   +5 more
wiley   +1 more source

Composites of Shellac and Silver Nanowires as Flexible, Biobased, and Corrosion‐Resistant Transparent Conductive Electrodes

Advanced Functional Materials, EarlyView.
Shellac, a centuries‐old natural resin, is reimagined as a green material for flexible electronics. When combined with silver nanowires, shellac films deliver transparency, conductivity, and stability against humidity. These results position shellac as a sustainable alternative to synthetic polymers for transparent conductors in next‐generation ...
Rahaf Nafez Hussein, Tiago Carneiro Gomes, Eliza Ng, Simon Rondeau‐Gagné, Tricia Breen Carmichael   +4 more
wiley   +1 more source

A Non-Intrusive Thermal Fault Inversion Method for GIS Using a POD-Kriging Surrogate Model and the Grey Wolf Optimizer

Energies
To address the inverse identification of contact-related thermal faults in gas-insulated switchgear (GIS), this study proposes a method for contact resistance inversion and internal temperature field reconstruction.
Linhong Yue, Hao Yang, Congwei Yao, Yanan Yuan, Kunyu Song   +4 more
doaj   +1 more source

DNA‐Templated 2D Heterostructures as Phototriggered Dynamic Nanohybrids: From Releasing Molecular Loads to Controlling Enzyme Biocatalytic Function

Advanced Functional Materials, EarlyView.
DNA strands are employed both as dynamic linkers and nanoscale templates for the integration of Ag2S nanoparticles on MoS2, which in turn imparted photothermal responsiveness; this feature permits the selective cargo (fluorophore, quantum dots or an enzyme) release from the MoS2 surface in response to local heat induced by light irradiation.
Kai Chen, Haosen Miao, Weiying Hong, Matteo Palma   +3 more
wiley   +1 more source

To Diagnostics of Heat Conductivity Resistance of Building Exterior/Outside Fencing Constructions

Известия высших учебных заведений и энергетических объединенний СНГ: Энергетика, 2010
The paper proposes a mathematical model of a non-stationary heat conductivity of fencing constructions of heated buildings with the purpose to calculate their thermal resistance.
B. M. Khroustalev, V. D. Akeliev, V. D. Sizov, I. M. Zolotoreva   +3 more
doaj  

From Food to Power: Hydrogel Thermoelectrics for Ingestible Electronics

Advanced Functional Materials, EarlyView.
We introduce a fully edible thermoelectric–electrochromic platform that harvests heat from food and converts it into a visible color change. N‐type and p‐type hydrogel thermoelectric generators connected in series power anthocyanin‐based electrochromic displays, demonstrating the feasibility of safe, biodegradable, ingestible systems for on‐food ...
Antonia Georgopoulou, Bokeon Kwak, Dario Floreano, Esther Amstad   +3 more
wiley   +1 more source

Intermediate Resistive State in Wafer‐Scale Vertical MoS2 Memristors Through Lateral Silver Filament Growth for Artificial Synapse Applications

Advanced Functional Materials, EarlyView.
In MOCVD MoS2 memristors, a current compliance‐regulated Ag filament mechanism is revealed. The filament ruptures spontaneously during volatile switching, while subsequent growth proceeds vertically through the MoS2 layers and then laterally along the van der Waals gaps during nonvolatile switching.
Yuan Fa, Milan Buttberg, Ke Ran, Rana Walied Ahmad, Dennis Braun, Lukas Völkel, Jimin Lee, Sofía Cruces, Bart Macco, Bárbara Canto, Holger Lerch, Thorsten Wahlbrink, Holger Kalisch, Michael Heuken, Andrei Vescan, Joachim Mayer, Zhenxing Wang, Ilia Valov, Stephan Menzel, Max C. Lemme   +19 more
wiley   +1 more source

Selection and application strategy of thermal interface materials for in-orbit thermal management of space cameras

Case Studies in Thermal Engineering
This study investigates the trade-off between MoS2 cold-welding resistance and interfacial thermal resistance (ITR). This balance is critical for the thermal management of space cameras. The research follows the ASTM D-5470 standard.
Caixia Liu, Junjun Qin, Yonglin Bai, Yifan Zhang, Chunyan Liao, Jiatao Wang, Yinlin Li   +6 more
doaj   +1 more source