Numerical simulation of uniaxial tensile residual stress and interface failure of SiCf/Ti3Al composite materials [PDF]
Journal of Hebei University of Science and TechnologyIn order to investigate the influence of thermal residual stress on the tensile properties of SiCf/Ti3Al composites generated in uniaxial tension, a three-dimensional mesoscale model including fibers, matrix, and interface was constructed by using ABAQUS
Quanxin LI +9 more
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Graphitized-rGO/Polyimide Aerogel as the Compressible Thermal Interface Material with Both High In-Plane and Through-Plane Thermal Conductivities. [PDF]
Materials (Basel), 2021 Lv P, Cheng H, Ji C, Wei W.
europepmc +1 more source
A compliant microstructured thermal interface material for dry and pluggable interfaces
International Journal of Heat and Mass Transfer, 2019 Abstract Thermal interface materials (TIMs), such as thermal pastes and pads, can successfully enhance contact thermal conductance by filling the gaps caused by the surface nonflatness and roughness. However, there is still an unaddressed demand for TIMs which can be applied to pluggable or reworkable interfaces in electronic systems, such as in opto-
Cui, J. +3 more
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Advanced Engineering Materials, EarlyView.Carbon‐free inert anodes are essential for decarbonizing aluminum electrolysis. This study investigates a recyclate‐based MgO‐316L steel composite anode tested under galvanostatic Hall–Héroult conditions in cryolite at 1000°C. Microstructural analysis reveals selective MgO fluorination, spinel and oxide layer formation, electrolyte infiltration, and ...
Serhii Yaroshevskyi +7 more
wiley +1 more source
Powder Optimization Strategies for Binder Jetting Printing of BaTiO3 and Ba0,6Sr0,4TiO3 Ceramics
Advanced Engineering Materials, EarlyView.Powder optimization is investigated to enable binder jetting of BaTiO3 and Ba0.6Sr0.4TiO3 ferroelectric ceramics. The antagonistic relationship between flowability and binder compatibility is addressed through binder impregnation of granulated powders and fumed silica addition to fine powders.
Fanny Pruvost +4 more
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Innocuous, Highly Conductive, and Affordable Thermal Interface Material with Copper-Based Multi-Dimensional Filler Design. [PDF]
Biomolecules, 2021 Kim W, Kim C, Lee W, Park J, Kim D.
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Influence of an Oxygen‐Free Atmosphere on Diamond‐Single‐Grain Scratching of Ti–6Al–4V
Advanced Engineering Materials, EarlyView.Single‐grain scratching of Ti–6Al–4V is investigated under controlled, oxygen‐free, and ambient atmospheres using a novel experimental setup with in situ high‐speed imaging. The approach enables direct observation of chip formation and adhesion under suppressed oxidation.
Berend Denkena +2 more
wiley +1 more source
Applied Physics ExpressWe have developed an experimental method to extract interfacial thermal resistance (ITR) at an organic/semiconductor interface based on optical-interference contactless thermometry.
Jiawen Yu +2 more
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iScienceSummary: Macroscopic conductive solid-state thermal diodes, composed of two dissimilar materials, are approaching limits in rectification performance and operating range. Beyond material choice, alternative design strategies have been explored.
Katja Vozel, Andrej Kitanovski
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Thermal Protection Supplement for Reducing Interface Thermal Mismatch [PDF]
A thermal protection system that reduces a mismatch of thermal expansion coefficients CTE between a first material layer (CTE1) and a second material layer (CTE2) at a first layer-second layer interface.
Leiser, Daniel B., Stewart, David A.
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