Results 121 to 130 of about 8,274,419 (297)

Rapidly Solidified High‐Strength Invar 36 Prepared by Planar‐Flow Melt Spinning

open access: yesAdvanced Engineering Materials, EarlyView.
The Invar 36 alloy was rapidly solidified using the planar‐flow melt‐spinning technique. Ribbon samples with thicknesses ranging from 20 to 160 mm were produced. As the grain size of the ribbon decreased to sub‐micron levels, the hardness increased by more than 2 times.
Bekir Akgül, Mehmet Kul
wiley   +1 more source

Numerical study of macroscopic thermal diodes: Influence of interface topography and contact resistance

open access: yesiScience
Summary: Macroscopic conductive solid-state thermal diodes, composed of two dissimilar materials, are approaching limits in rectification performance and operating range. Beyond material choice, alternative design strategies have been explored.
Katja Vozel, Andrej Kitanovski
doaj   +1 more source

An anti-leakage liquid metal thermal interface material. [PDF]

open access: yesRSC Adv, 2020
Huang K   +5 more
europepmc   +1 more source

Gallium Microalloying in Bi–Sn Solders: Interfacial Phase Formation, Wettability, and Long‐Term Shear Reliability Under Isothermal Aging

open access: yesAdvanced Engineering Materials, EarlyView.
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová   +6 more
wiley   +1 more source

A novel technique for evaluating the degradation of engine components non-destructively [PDF]

open access: yes, 2002
This thesis was submitted for the degree of Doctor of Philosophy and awarded by Brunel University.Impedance spectroscopy (IS) was used to evaluate the microstructural changes of a thermally-grown oxide (TGO) layer on a nickel-based superalloy or bond ...
Ali, Md Shawkat
core   +2 more sources

Technology Enabling Innovation 1 Thermal-Mechanical Decoupling by a Thermal Interface Material

open access: yes, 1970
Thermal-mechanical decoupling by a silicone thermal interface material (TIM) is one of the most important properties in electronic applications involving a printed circuit board (PCB).
Ph.D Haibing Zhang   +3 more
core  

High‐Entropy Alloy Interlayers Toward Advanced Joining for High‐Performance Structural Applications: Current Progress and Emerging Challenges

open access: yesAdvanced Engineering Materials, EarlyView.
HEA interlayers offer a versatile route for joining high‐performance structural materials. Their compositional and structural design regulates interfacial reactions, suppresses brittle IMCs, and improves metallurgical bonding. Sandwich interlayers further integrate defect healing with precipitation strengthening, enabling improved strength–ductility ...
Lin Yuan   +4 more
wiley   +1 more source

Electrically insulating thermal interface material with ultrahigh thermal conductivity enabled by vertical boron nitride fibers

open access: yesAIP Advances
With the increasing integration levels of modern electronic products, effective thermal management has become a critical concern to ensure the operational efficiency and longevity of electronic devices. Developing thermal interface materials that possess
Haoran Yang   +7 more
doaj   +1 more source

Characterization of Thermal Interface Materials to Support Thermal Simulation

open access: yes, 2007
In this paper new characterization equipment for thermal interface materials is presented. Thermal management of electronic products relies on the effec-tive dissipation of heat. This can be achieved by the optimization of the system design with the help of simulation methods. The precision of these models relies also on the used material data. For the
Schacht, R.   +6 more
openaire   +2 more sources

Materials‐Driven Additive Manufacturing for Electrical Machines: Qualification‐Oriented Design Beyond Geometric Freedom

open access: yesAdvanced Engineering Materials, EarlyView.
This perspective reframes additive manufacturing for electrical machines as a qualification‐limited materials and architecture design problem. It links process–structure–property–performance relationships to magnetic, conducting, dielectric, and thermal property windows, highlighting where AM can enable segmented magnetic circuits, permanent magnet ...
Dénes Fodor, Loránd Szabó
wiley   +1 more source

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