Results 51 to 60 of about 133,007 (263)
The implementation of thermal barriers in thermoelectric materials improves their power conversion rates effectively. For this purpose, material boundaries are utilized and manipulated to affect phonon transmissivity.
Sven Heinz +4 more
doaj +1 more source
A flexure‐based variable stiffness structure is developed by integrating phase‐change modulation and adhesive interfacial locking of gallium. The design enables a wide stiffness variability, transitioning from soft, flexible behavior to rigid, load‐supporting performance.
Sungjin Kim +2 more
wiley +1 more source
Chemical building material has become the fourth largest building material after wood, cement and steel. With the advantages of low energy consumption, environmental protection, low cost, good stability, toughening and strengthening, etc., it has been ...
Shuying Gao, Junwang Liu, Guizhi Gao
doaj +1 more source
Low‐cycle fatigue damage in Mn–Mo–Ni reactor pressure vessel steel is examined using a combined electron backscatter diffraction and positron annihilation lifetime spectroscopy approach. The study correlates texture evolution, dislocation substructure development, and vacancy‐type defect formation across uniform, necked, and fracture regions, providing
Apu Sarkar +2 more
wiley +1 more source
Geometry‐driven thermal behavior in wire‐arc additive manufacturing (WAAM) influences microstructural evolution during nonequilibrium solidification of a chemically complex Fe–Cr–Nb–W–Mo–C nanocomposite system. By comparing different deposits configurations, distinct entropy–cooling rate correlations, segregation, and carbide evolution are revealed ...
Blanca Palacios +5 more
wiley +1 more source
This research work investigates the effect of nickel addition (Ni) on electromigration failure resistance of lead-free solder alloy Sn–30Bi as a thermal interface material.
Munim Shahriar Jawad +3 more
doaj +1 more source
Structural Analysis of Power Devices and Assemblies by Thermal Transient Measurements
Power modules composed of semiconductor dice, thermal interface layers, and cooling mounts can be characterized by thermal transient testing at their actual position (in situ). This paper demonstrates that transient testing enables tracking of changes in
Gabor Farkas +2 more
doaj +1 more source
The thermal contact resistance of a steel-ceramic interface with oxide intermediates
Metal structures covered by refractories are widely employed in high temperature processes such as incineration and metal production. The thermal resistance in refractories used in high temperature processes is associated with different phases, phase ...
Jussi Silvonen +2 more
doaj +1 more source
A hierarchical porous copper current collector is fabricated via three‐dimensional printing combined with pressureless sintering to stabilize lithium metal anodes. The interconnected architecture lowers local current density, guides uniform Li deposition within pores, and suppresses dendrite growth.
Alok Kumar Mishra, Mukul Shukla
wiley +1 more source
A combined finite element and phase‐field approach predicts the evolution of microstructure during the directional solidification of Ni‐based superalloys. The model reveals how withdrawal rate, temperature gradient, and wall thickness control the dendrite spacing, highlighting the strong effect of surface regions in thin sections where dendrite growth ...
Sean Böhm +3 more
wiley +1 more source

