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Mechanistic Structure-Property Relationships in Carbon/Polymer Composites: Connectivity, Junction Resistance, and Durability. [PDF]
Polymers (Basel)Sharma SK +6 more
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Thermal Interface Materials [PDF]
Journal of Materials Engineering and Performance, 2001 Cooling is critically needed for reliability, power and further miniaturization of microelectronics. Heat sinks are obviously important for heat dissipation. However, thermal interface materials (TIMs) are needed to improve thermal contacts, such as the thermal contact between a heat source (e.g., a microprocessor) and a heat sink.
D D L Chung, D D L Chung, Chung D D L
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Performance of Thermal Interface Materials
Small, 2022AbstractThe thermal interface materials (TIMs) used for improving thermal contacts are considered in terms of the performance, performance consideration criteria, performance evaluation methods, and material development approaches. The performance is described mainly by the thermal contact conductance, which refers to the conductance across the thermal
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Materials Science Forum, 2020
Thermal interface material (TIM) had been well conducted and developed by using several material as based material. A lot of combination and mixed material were used to increase thermal properties of TIM. Combination between materials for examples carbon nanotubes (CNT) and epoxy had had been used before but the significant of the studied are not ...
Mazlan Mohamed +6 more
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Thermal interface material (TIM) had been well conducted and developed by using several material as based material. A lot of combination and mixed material were used to increase thermal properties of TIM. Combination between materials for examples carbon nanotubes (CNT) and epoxy had had been used before but the significant of the studied are not ...
Mazlan Mohamed +6 more
openaire +1 more source
Thermal Conductivity of Thermal Interface Materials
MRS Proceedings, 2007AbstractWhile detailed theories exist for thermal conduction due to electrons and phonons in crystalline solids, phonon scattering and transmission at solid/solid interfaces is not as well understood. Steady increases in the power density of microelectronic devices have resulted in an increasing need in the electronics industry for an understanding of ...
Travis Z. Fullem, Eric J. Cotts
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Performance and testing of thermal interface materials
Microelectronics Journal, 2003Abstract The increasing power and reduced die size of CPUs used in computers increases a need for significantly improved thermal interface materials (TIM). The TIM is used to reduce contact resistance at the CPU–heat sink interface. This work provides a state-of-the-art assessment on ‘thermal interface materials’, including fundamentals, materials ...
J. P. Gwinn, R. L. Webb
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Superior thermal interface materials for thermal management
Composites Communications, 2019Abstract Thermal interface materials (TIMs) have been widely used in various electronic devices and are crucial for next generation electronics such as flexible electronics. Ultrathin full carbon films with extraordinary high thermal conductivity (k) and promising mechanical strength have been well documented, but the brittleness (elongation at break~
Lu Bai, Rui-Ying Bao, Shi-wei Wang
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