Results 211 to 220 of about 146,341 (255)

Advanced Thermal Interface Materials

MRS Proceedings, 2006
ABSTRACTThermal interface materials (TIMs) are used to dissipate thermal energy from a heat-generating device to a heat sink via conduction. The growing power density of the electronic device demands next-generation high thermal conductivity and/or low thermal resistance TIMs.
Yimin Zhang, Allison Xiao, Jeff McVey
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Characterization of Thermal Interface Materials

2006 1st Electronic Systemintegration Technology Conference, 2006
In this paper new characterization equipment for thermal interface materials is presented. Thermal management of electronic products relies on the effective dissipation of heat. This can be achieved by the optimization of the system design with the help of simulation methods. The precision of these models relies also on the used material data.
Ralph Schacht, Daniel May, Bernhard Wunderle, Olaf Wittler, Astrid Gollhardt, Bernd Michel, Herbert Reichl   +6 more
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Thermal Interface Materials

2009
Increasing electronic device performance has historically been accompanied by increasing power and increasing on-chip power density both of which present a cooling challenge. Thermal Interface Material (TIM) plays a key role in reducing the package thermal resistance and the thermal resistance between the electronic device and the external cooling ...
Ravi Prasher, Chia-Pin Chiu
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Electrical and Thermal Interface Materials

Pan Pacific Symposium, 2008
ABSTRACT Solder is the mainstay of electronics assembly, but many connections need to be made with other materials. This paper addresses the performance of the latest generation of two of these: thermally and electrically conductive materials.
Rob Emery, Tanawan Chaowasakoo
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Engineered thermal interface material

2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014
The power dissipation and device junction temperature control in high end processors, stacked and hybrid packages, test and burn-in systems, LED devices, etc. present challenges in cooling. Many types of consumer devices and sensors are proliferating. All these applications require an ongoing improvement in thermal management.
Lyndon Larson, Yin Tang, Loren Durfee, Cassandra Hale, David Plante, Sushumna Iruvanti, Rebecca Wagner, Taryn Davis, Hai Longworth, Annique Lavoie, Richard Langois   +10 more
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Electrospinning of thermal interface materials

Advances in Colloid and Interface Science
As electronic systems continue to evolve toward higher integration and power densities, the demand for efficient thermal interface materials (TIMs) grows increasingly urgent. Electrospinning has emerged as a versatile and scalable approach for fabricating TIMs with tunable nanofiber architectures and tailored interfacial properties.
Xiachen, Xiao, Baoshan, Xie, Liangxuan, Ouyang, Juefei, Yang, Chengshuai, Li, Jing, Zhao, Youfu, Lv, Xiaoliang, Zeng, Chuanchang, Li   +8 more
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Thermal Characterizations of Solid Thermal Interface Materials

2008 10th Electronics Packaging Technology Conference, 2008
Solid thermal interface materials are often used in thermal reliability tests of IC packages to minimize contact thermal resistance without contaminating the test environment. In this paper, thermal characterizations of solid thermal interface materials, including indium, graphite, and fiberglass were conducted. A TIM tester was utilized to measure the
Hengyun Zhang, Y.C. Mui, Poh-Eng Tan, Soon-Hwa Ng   +3 more
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Thermal characterization of thermal interface material bondlines

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2008
Minimizing the thermal resistance of thermal interface material (TIM) bondlines is of interest to the electronics industry. The thermal interface material class examined in this study comprises epoxy based adhesives in which conductive filler particles are suspended.
T. Z. Fullem, D. F. Rae, A. Sharma, J. A. Wolcott, E. J. Cotts   +4 more
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Recent Advances in Thermal Interface Materials

World Scientific Annual Review of Functional Materials, 2022
Ever-increasing performance and functions of electronic systems are pushing the requirements for heat dissipation of devices at an unprecedented pace. To package individual devices (especially those working in high-power mode), research and development of thermal interface materials (TIMs) have accelerated since the beginning of this century.
Jing Cao, Tzee Luai Meng, Xikui Zhang, Na Gong, Rahul Karyappa, Chee Kiang Ivan Tan, Ady Suwardi, Qiang Zhu, Hongfei Liu   +8 more
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Characterization of nanostructured thermal interface materials – A review

International Journal of Thermal Sciences, 2011
Abstract Due to high heat dissipation rates in current and projected future semiconductor devices, much attention has been given to improving paths of heat transport within the device package. A key focus is on improved thermal interface materials (TIMs), used in joining surfaces in a microelectronic package to reduce interface thermal resistance ...
Andrew J. McNamara, Yogendra K. Joshi, Zhuomin M. Zhang   +2 more
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