Results 221 to 230 of about 7,625,249 (285)

Kinetics‐Controlled Architecture of Binder‐Free Organic Electrodes for Enhanced Ion Transport

Advanced Functional Materials, EarlyView.
Pulse reverse electrodeposition controls nucleation and growth to create hierarchically porous Py‐derived oligomeric electrodes with enhanced ionic accessibility and reduced transport resistance. The resulting binder‐free architectures translate these transport advantages into practical sodium‐storage functionality.
Satendra Kumar, María del Carmen Giménez‐López   +1 more
wiley   +1 more source

Improving High-Temperature Operational Stability of Inverted Perovskite Solar Cells Through MXene Heat-Dissipating Layers. [PDF]

Adv Sci (Weinh)
Karimipour M, Monrós Oliveras N, Tian Z, Swoboda T, Salutari F, Sledzinska M, Spadaro MC, Tabah Tanko K, Rodríguez-Viejo J, Arbiol J, Zhang T, Gao F, Lira-Cantu M.   +12 more
europepmc   +1 more source

Reconstructing Residual‐Solvent‐Involved Li+ Coordination in PVDF‐HFP Polymer Electrolytes for Stable Lithium Metal Batteries

Advanced Functional Materials, EarlyView.
2,2,2‐trifluoroethanamide‐mediated coordination regulation reconstructs the local Li+ environment in PVDF‐HFP polymer electrolytes by weakening residual DMF‐dominated coordination and promoting TFSI−‐involved anion‐rich solvation. This strategy facilitates Li+ migration and interfacial desolvation, promotes the formation of a thin inorganic‐rich SEI ...
Xiangsong Jiang, Qi Liu, Haohan Chen, Jianwei Lu, Yupeng Feng, Youwei Wang, Tianhao Zhao, Na Jiang, Wei Yang, Fei Li, Chunwei Dong, Shubiao Xia, Zhenzhen Shen, Weiwei Lei, Dan Liu, Jianping Long, Shimou Chen, Anjun Hu   +17 more
wiley   +1 more source

Application of Porous Copper-Based Interconnect Materials in Electronic Packaging: A Brief Review. [PDF]

Materials (Basel)
Liu J, Qiu L, Wang P, Wang F, Huang J, Chen H, Zhao H, Chen F.   +7 more
europepmc   +1 more source

Programmable Soft Actuator with Multi‐Responsiveness Based on Conductive MOF‐Liquid Crystal Polymer Composite

Advanced Functional Materials, EarlyView.
A sequential dual‐alignment strategy independently programs the orientation of conductive metal‐organic framework (c‐MOF) microrods and liquid crystals within a composite film. This approach creates an asymmetric bilayer structure that enables precise, multi‐responsive actuation.
Taegyun Hong, Geunho Kim, Changjae Lee, Sarang Lee, Jesse G. Park, Dong Ki Yoon   +5 more
wiley   +1 more source

Investigation on Cutting Fluid Penetration Kinetics and Friction Reduction Mechanism of Micro-Textured Tools via Direct Vapor-Phase Capillary Filling. [PDF]

Materials (Basel)
Ge D, Ma J, Liu A, Tang Z, Wu J, Sun Y, Zhang Y.   +6 more
europepmc   +1 more source

Pressure‐Assisted Dimensional Transformation of 2D Hydrogenated Borophene into 0D Boron Quantum Dots

Advanced Functional Materials, EarlyView.
Hydrogenated borophene (HB) is transformed into distinct boron nanostructures through a solvent‐free thermal process. Under flowing nitrogen, hydrogen escape promotes reconstruction into B2O3 nanoplatelets, whereas hydrogen‐induced pressure under sealed conditions facilitates fragmentation into boron quantum dots.
Ozden Gunes Yildiz, Ramin Yazdaanpanah, Yongfeng Guo, Pouriya Naziri, Sachin Kulkarni, Martina Mercurio, Maria Cristina Larciprete, Ilaria Fratoddi, Paul Simon, Wan‐Lu Li, Koray Aydin, Umut Aydemir   +11 more
wiley   +1 more source

Improving thermal shock resistance of segmented thermoelectric devices via metal foam integration. [PDF]

Nat Commun
Yu K, Du J, Tong H, Sun Y, Yang X, Wu H, Zhang X, Liu Z, Li C, Guo F, Sui J.   +10 more
europepmc   +1 more source

Electrical Tuning of Ferrimagnetic Spin Alignment Angle and Compensation Temperature in Pt/IrMn3/CoGd Multilayers

Advanced Functional Materials, EarlyView.
Spin‐orbit torque controls the Néel vector of antiferromagnetic IrMn3, which selectively exchange‐couples with spins of Co only in the ferrimagnetic CoGd. This selective interfacial pinning induces the non‐collinear spiral spin configuration, leading to a non‐uniform distribution of local compensation temperature along the film thickness, and enabling ...
Won‐Chang Choi, Tae‐Bo Sim, Kwonjin Park, Tae‐Hwan Kim, Soobeom Lee, Bao Xuan Tran, Soojung Kim, Chun‐Yeol You, Jung‐Il Hong   +8 more
wiley   +1 more source

Microstructure and Shear Strength of SiC Joints Brazed with a Si-Ti-Al Filler Alloy. [PDF]

Materials (Basel)
Wei L, Lv Z, Xu R, Zhao Y, Wang C, Zheng Y, Li X.   +6 more
europepmc   +1 more source