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Simultaneous thermal/flow characterization of thermal interface materials
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016Thermal interface materials used for dissipation of heat in electronic assemblies are often exposed to working conditions that may change the mechanical as well as thermal behavior over time due to both intrinsic change as well as environmental influence [1]. Currently, among thermal interface material solutions, particle filled greases are common. For
Y. Singh, N. Bajaj, G. Subbarayan
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The Future of Metal Thermal Interface Materials
Soldering and Reliability Conferences, 2022ABSTRACT This file is a Powerpoint presentation only.
Ron Lasky, Tim Jensen, Michael Dickey
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Thermal Interface Materials Testing
SMTA International, 2009ABSTRACT There exists a need to efficiently remove heat from power electronics within power systems to enhance performance. Thermal management is a critical function to that operation. Reducing the junction temperature of semiconductor power electronic devices enables them to operate at higher currents. Lowering operating temperatures
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Joint Thermal Resistance and Thermal Interface Materials
2023Heat conduction across a joint of two solids occurs practically in every heat generated system. A significant temperature gradient occurs as heat is transferred by conduction across the joint of two solids. This is due to the thermal contact resistance generated by the surface irregularities.
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Reliability of thermal interface materials: A review
Applied Thermal Engineering, 2013Abstract Thermal interface materials (TIMs) are used extensively to improve thermal conduction across two mating parts. They are particularly crucial in electronics thermal management since excessive junction-to-ambient thermal resistances can cause elevated temperatures which can negatively influence device performance and reliability. Of particular
Jens Due, Anthony J. Robinson
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Joint Healing Thermal Interface Material
International Symposium on Microelectronics, 2016Abstract Today, thermal interface materials (TIM) are widely used between a processor die and an integrated heat-spreader (IHS) to provide a good thermal conduction path for heat transfer from the electronic package. As the current trend towards larger “die size designs” progresses, the performance and reliability of the TIM will be a ...
Jingting Yang +5 more
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Thermal Performance and Reliability of Thermal Interface Materials: A Review
7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006Interface thermal resistance minimization has been identified as a critical issue for the thermal management of electronic systems by the NEMI 2004 technology roadmap [1]. In current high-performance air-cooled microelectronic applications, the component-to-heat sink interfacial contact thermal resistance can be comparable to that of the actual heat ...
P. Rodgers +3 more
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Recent progress of thermal interface materials
2008 2nd Electronics Systemintegration Technology Conference, 2008This paper reviews the status and recent progress achieved in the research of thermal interface materials (TIMs). The focus is on the research work performed in academia. The research and development work carried out in industry is also generally introduced.
J. Liu +3 more
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Challenges in thermal interface material testing
Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, 2006Characterization of thermal properties of thermal interface materials (TIMs) has gained increasing importance as the relative percentage of overall semiconductor package material thermal resistance attributable to the TIMs has increased. The development of new TIM materials has increasingly focused on materials with very high performance and, in ...
Clemens J.M. Lasance +3 more
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Thermal interface tailoring in composite materials
Diamond and Related Materials, 2010The thermal transport in heterogeneous materials systems, such as in composites, is essentially controlled by the phonon scattering phenomena at the materials interface due to the interface materials property mismatch. Such phenomena are also prevalent in joints or component interfaces.
A.K. Roy +5 more
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