Results 241 to 250 of about 7,625,249 (285)

Thermal Conductivity of Thermal Interface Materials

MRS Proceedings, 2007
AbstractWhile detailed theories exist for thermal conduction due to electrons and phonons in crystalline solids, phonon scattering and transmission at solid/solid interfaces is not as well understood. Steady increases in the power density of microelectronic devices have resulted in an increasing need in the electronics industry for an understanding of ...
Travis Z. Fullem, Eric J. Cotts
openaire   +1 more source

Performance and testing of thermal interface materials

Microelectronics Journal, 2003
Abstract The increasing power and reduced die size of CPUs used in computers increases a need for significantly improved thermal interface materials (TIM). The TIM is used to reduce contact resistance at the CPU–heat sink interface. This work provides a state-of-the-art assessment on ‘thermal interface materials’, including fundamentals, materials ...
J. P. Gwinn, R. L. Webb
openaire   +2 more sources

Electrospinning of thermal interface materials

Advances in Colloid and Interface Science
As electronic systems continue to evolve toward higher integration and power densities, the demand for efficient thermal interface materials (TIMs) grows increasingly urgent. Electrospinning has emerged as a versatile and scalable approach for fabricating TIMs with tunable nanofiber architectures and tailored interfacial properties.
Xiachen, Xiao, Baoshan, Xie, Liangxuan, Ouyang, Juefei, Yang, Chengshuai, Li, Jing, Zhao, Youfu, Lv, Xiaoliang, Zeng, Chuanchang, Li   +8 more
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Electrical and Thermal Interface Materials

Pan Pacific Symposium, 2008
ABSTRACT Solder is the mainstay of electronics assembly, but many connections need to be made with other materials. This paper addresses the performance of the latest generation of two of these: thermally and electrically conductive materials.
Rob Emery, Tanawan Chaowasakoo
openaire   +1 more source

Advanced Thermal Interface Materials

MRS Proceedings, 2006
ABSTRACTThermal interface materials (TIMs) are used to dissipate thermal energy from a heat-generating device to a heat sink via conduction. The growing power density of the electronic device demands next-generation high thermal conductivity and/or low thermal resistance TIMs.
Yimin Zhang, Allison Xiao, Jeff McVey
openaire   +1 more source

Engineered thermal interface material

2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014
The power dissipation and device junction temperature control in high end processors, stacked and hybrid packages, test and burn-in systems, LED devices, etc. present challenges in cooling. Many types of consumer devices and sensors are proliferating. All these applications require an ongoing improvement in thermal management.
Lyndon Larson, Yin Tang, Loren Durfee, Cassandra Hale, David Plante, Sushumna Iruvanti, Rebecca Wagner, Taryn Davis, Hai Longworth, Annique Lavoie, Richard Langois   +10 more
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Thermal Characterizations of Solid Thermal Interface Materials

2008 10th Electronics Packaging Technology Conference, 2008
Solid thermal interface materials are often used in thermal reliability tests of IC packages to minimize contact thermal resistance without contaminating the test environment. In this paper, thermal characterizations of solid thermal interface materials, including indium, graphite, and fiberglass were conducted. A TIM tester was utilized to measure the
Hengyun Zhang, Y.C. Mui, Poh-Eng Tan, Soon-Hwa Ng   +3 more
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Thermal characterization of thermal interface material bondlines

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2008
Minimizing the thermal resistance of thermal interface material (TIM) bondlines is of interest to the electronics industry. The thermal interface material class examined in this study comprises epoxy based adhesives in which conductive filler particles are suspended.
T. Z. Fullem, D. F. Rae, A. Sharma, J. A. Wolcott, E. J. Cotts   +4 more
openaire   +1 more source

Thermal Interface Materials Testing

SMTA International, 2009
ABSTRACT There exists a need to efficiently remove heat from power electronics within power systems to enhance performance. Thermal management is a critical function to that operation. Reducing the junction temperature of semiconductor power electronic devices enables them to operate at higher currents. Lowering operating temperatures
openaire   +1 more source

Characterization of nanostructured thermal interface materials – A review

International Journal of Thermal Sciences, 2011
Abstract Due to high heat dissipation rates in current and projected future semiconductor devices, much attention has been given to improving paths of heat transport within the device package. A key focus is on improved thermal interface materials (TIMs), used in joining surfaces in a microelectronic package to reduce interface thermal resistance ...
Andrew J. McNamara, Yogendra K. Joshi, Zhuomin M. Zhang   +2 more
openaire   +1 more source