Results 241 to 250 of about 644,566 (284)
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Thermal Conductivity of Thermal Interface Materials
MRS Proceedings, 2007AbstractWhile detailed theories exist for thermal conduction due to electrons and phonons in crystalline solids, phonon scattering and transmission at solid/solid interfaces is not as well understood. Steady increases in the power density of microelectronic devices have resulted in an increasing need in the electronics industry for an understanding of ...
Travis Z. Fullem, Eric J. Cotts
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Thermal Characterizations of Solid Thermal Interface Materials
2008 10th Electronics Packaging Technology Conference, 2008Solid thermal interface materials are often used in thermal reliability tests of IC packages to minimize contact thermal resistance without contaminating the test environment. In this paper, thermal characterizations of solid thermal interface materials, including indium, graphite, and fiberglass were conducted. A TIM tester was utilized to measure the
Hengyun Zhang +3 more
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Superior thermal interface materials for thermal management
Composites Communications, 2019Abstract Thermal interface materials (TIMs) have been widely used in various electronic devices and are crucial for next generation electronics such as flexible electronics. Ultrathin full carbon films with extraordinary high thermal conductivity (k) and promising mechanical strength have been well documented, but the brittleness (elongation at break~
Chang Ping Feng +7 more
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High performance liquid metal thermal interface materials
Nanotechnology, 2020Abstract Conventional thermal interface materials (TIMs) as widely used in thermal management area is inherently limited by their relatively low thermal conductivity. From an alternative, the newly emerging liquid metal based thermal interface materials (LM-TIMs) open a rather promising way, which can pronouncedly improve the thermal ...
Sen Chen, Zhongshan Deng, Jing Liu
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2009
Increasing electronic device performance has historically been accompanied by increasing power and increasing on-chip power density both of which present a cooling challenge. Thermal Interface Material (TIM) plays a key role in reducing the package thermal resistance and the thermal resistance between the electronic device and the external cooling ...
Ravi Prasher, Chia-Pin Chiu
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Increasing electronic device performance has historically been accompanied by increasing power and increasing on-chip power density both of which present a cooling challenge. Thermal Interface Material (TIM) plays a key role in reducing the package thermal resistance and the thermal resistance between the electronic device and the external cooling ...
Ravi Prasher, Chia-Pin Chiu
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Thermal characterization of thermal interface material bondlines
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2008Minimizing the thermal resistance of thermal interface material (TIM) bondlines is of interest to the electronics industry. The thermal interface material class examined in this study comprises epoxy based adhesives in which conductive filler particles are suspended.
T. Z. Fullem +4 more
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Joint Healing Thermal Interface Material
International Symposium on Microelectronics, 2016Abstract Today, thermal interface materials (TIM) are widely used between a processor die and an integrated heat-spreader (IHS) to provide a good thermal conduction path for heat transfer from the electronic package. As the current trend towards larger “die size designs” progresses, the performance and reliability of the TIM will be a ...
Jingting Yang +5 more
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Recent Advances in Thermal Interface Materials
World Scientific Annual Review of Functional Materials, 2022Ever-increasing performance and functions of electronic systems are pushing the requirements for heat dissipation of devices at an unprecedented pace. To package individual devices (especially those working in high-power mode), research and development of thermal interface materials (TIMs) have accelerated since the beginning of this century.
Jing Cao +8 more
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Characterization of Thermal Interface Materials
2006 1st Electronic Systemintegration Technology Conference, 2006In this paper new characterization equipment for thermal interface materials is presented. Thermal management of electronic products relies on the effective dissipation of heat. This can be achieved by the optimization of the system design with the help of simulation methods. The precision of these models relies also on the used material data.
Ralph Schacht +6 more
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Graphene-based thermal interface materials
2011 11th IEEE International Conference on Nanotechnology, 2011Thermal management in electronic circuits is becoming an important integral part of design considerations. Increasing power densities and speed of advanced computer chips motivate the search for more efficient thermal interface materials. Here we report preliminary results of experimental and theoretical investigations of the epoxy composites, which ...
Khan M. F. Shahil, Alexander A. Balandin
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