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Joint Thermal Resistance and Thermal Interface Materials
2023Heat conduction across a joint of two solids occurs practically in every heat generated system. A significant temperature gradient occurs as heat is transferred by conduction across the joint of two solids. This is due to the thermal contact resistance generated by the surface irregularities.
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Simultaneous thermal/flow characterization of thermal interface materials
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016Thermal interface materials used for dissipation of heat in electronic assemblies are often exposed to working conditions that may change the mechanical as well as thermal behavior over time due to both intrinsic change as well as environmental influence [1]. Currently, among thermal interface material solutions, particle filled greases are common. For
Y. Singh, N. Bajaj, G. Subbarayan
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THERMAL CHARACTERIZATION OF THERMAL INTERFACE MATERIALS
Experimental Techniques, 2008C.I. Chen +5 more
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Self–healing Thermal Interface Materials
2020Thermal interface materials (TIMs) are widely used as gap–filler materials between electronic devices such as LEDs and ICs and their heat sink and aim to control the heat dissipation and to provide mechanical anchoring. As the rated power densities of electronic devices are increasing rapidly, the TIMS are exposed to higher thermal and mechanical loads.
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Reliability for Thermal Interface Materials
Thermal interface materials (TIMs) are critical components in electronic packaging. Thermal greases are paste-like materials with high conductivity filler particles added to a polymer matrix to yield a high conductivity spreadable material. Throughout the operation of the electronic device, thermomechanical stresses lead to failure of thermal greases ...openaire +1 more source
International Materials Reviews
International Materials Reviews, 2018Johan Liu +2 more
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