Results 251 to 260 of about 644,566 (284)

Joint Thermal Resistance and Thermal Interface Materials

2023
Heat conduction across a joint of two solids occurs practically in every heat generated system. A significant temperature gradient occurs as heat is transferred by conduction across the joint of two solids. This is due to the thermal contact resistance generated by the surface irregularities.
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Simultaneous thermal/flow characterization of thermal interface materials

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016
Thermal interface materials used for dissipation of heat in electronic assemblies are often exposed to working conditions that may change the mechanical as well as thermal behavior over time due to both intrinsic change as well as environmental influence [1]. Currently, among thermal interface material solutions, particle filled greases are common. For
Y. Singh, N. Bajaj, G. Subbarayan
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Thermal contact resistance of cured gel polymeric thermal interface material

The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543), 2004
This paper reports the experimental results on the contact resistance of curable polymer gel thermal interface materials (TIM's) that have different mechanical properties due to difference in the rheology of the polymers. A semi-analytical model for the prediction of the thermal contact resistance of cured gel TIM's is also introduced in this paper.
R.S. Prasher, J.C. Matayabas
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Self–healing Thermal Interface Materials

2020
Thermal interface materials (TIMs) are widely used as gap–filler materials between electronic devices such as LEDs and ICs and their heat sink and aim to control the heat dissipation and to provide mechanical anchoring. As the rated power densities of electronic devices are increasing rapidly, the TIMS are exposed to higher thermal and mechanical loads.
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Low melting point thermal interface material

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258), 2003
A high performance thermal interface material has been developed that consists of a 25 /spl mu/m coating of low-melting-temperature alloy (LMTA) tinned on each side of a 50 /spl mu/m copper substrate. The alloy has a melting point below the maximum CPU operating temperature. Steady-state tests per ASTM D-5470 show 0.058 K-cm/sup 2//W at 138 kPa contact
R.L. Webb, J.P. Gwinn
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Thermal interface tailoring in composite materials

Diamond and Related Materials, 2010
The thermal transport in heterogeneous materials systems, such as in composites, is essentially controlled by the phonon scattering phenomena at the materials interface due to the interface materials property mismatch. Such phenomena are also prevalent in joints or component interfaces.
A.K. Roy, B.L. Farmer, S. Sihn, V. Varshney, S. Patnaik, S. Ganguli   +5 more
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Recent progress of thermal interface materials

2008 2nd Electronics Systemintegration Technology Conference, 2008
This paper reviews the status and recent progress achieved in the research of thermal interface materials (TIMs). The focus is on the research work performed in academia. The research and development work carried out in industry is also generally introduced.
J. Liu, null Teng Wang, B. Carlberg, M. Inoue   +3 more
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Challenges in thermal interface material testing

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, 2006
Characterization of thermal properties of thermal interface materials (TIMs) has gained increasing importance as the relative percentage of overall semiconductor package material thermal resistance attributable to the TIMs has increased. The development of new TIM materials has increasingly focused on materials with very high performance and, in ...
Clemens J.M. Lasance, Cameron T. Murray, David L. Saums, Marta Rencz   +3 more
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Characterization of nanostructured thermal interface materials – A review

International Journal of Thermal Sciences, 2011
Abstract Due to high heat dissipation rates in current and projected future semiconductor devices, much attention has been given to improving paths of heat transport within the device package. A key focus is on improved thermal interface materials (TIMs), used in joining surfaces in a microelectronic package to reduce interface thermal resistance ...
Andrew J. McNamara, Yogendra K. Joshi, Zhuomin M. Zhang   +2 more
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Thermal Interface Material Resistance Measurement Apparatus

2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, 2006
It is well known that as the size of microprocessors decreases with respect to Moore's law, cooling issues have become more predominant and critical for the electronics industry. One source of thermal resistance requiring more characterization is Thermal Interface Materials, TIMs.
S.S. Badoni, null Jinny Rhee
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