Results 231 to 240 of about 644,566 (284)

Delamination of lithium iron phosphate from aluminum foil using electrical pulsed discharge without heat, water, or chemicals. [PDF]

Sci Rep
Tokoro C, Kurihara T, Narita A, Takaya Y, Suzuki S.   +4 more
europepmc   +1 more source

Research Progress on Nanopolymer Composites in Civil Engineering. [PDF]

Nanomaterials (Basel)
Gao T, Zhao Y, Niu Y, Cao X.
europepmc   +1 more source

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Metal-Level Thermally Conductive yet Soft Graphene Thermal Interface Materials

ACS Nano, 2019
Along with the technology evolution for dense integration of high-power, high-frequency devices in electronics, the accompanying interfacial heat transfer problem leads to urgent demands for advanced thermal interface materials (TIMs) with both high through-plane thermal conductivity and good compressibility.
Wen Dai, Tengfei Ma, Qingwei Yan, Jingyao Gao, Xue Tan, Le Lv, Hao Hou, Qiuping Wei, Jinhong Yu, Jianbo Wu, Yagang Yao, Shiyu Du, Rong Sun, Nan Jiang, Yan Wang, Jing Kong, Chingping Wong, Shigeo Maruyama, Cheng-Te Lin   +18 more
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2D Materials‐Based Thermal Interface Materials: Structure, Properties, and Applications

Advanced Materials
AbstractThe challenges associated with heat dissipation in high‐power electronic devices used in communication, new energy, and aerospace equipment have spurred an urgent need for high‐performance thermal interface materials (TIMs) to establish efficient heat transfer pathways from the heater (chip) to heat sinks.
Wen Dai, Yandong Wang, Maohua Li, Lu Chen, Qingwei Yan, Jinhong Yu, Nan Jiang, Cheng‐Te Lin   +7 more
openaire   +4 more sources

Performance of Thermal Interface Materials

Small, 2022
AbstractThe thermal interface materials (TIMs) used for improving thermal contacts are considered in terms of the performance, performance consideration criteria, performance evaluation methods, and material development approaches. The performance is described mainly by the thermal contact conductance, which refers to the conductance across the thermal
openaire   +2 more sources

Engineered thermal interface material

2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014
The power dissipation and device junction temperature control in high end processors, stacked and hybrid packages, test and burn-in systems, LED devices, etc. present challenges in cooling. Many types of consumer devices and sensors are proliferating. All these applications require an ongoing improvement in thermal management.
Lyndon Larson, Yin Tang, Loren Durfee, Cassandra Hale, David Plante, Sushumna Iruvanti, Rebecca Wagner, Taryn Davis, Hai Longworth, Annique Lavoie, Richard Langois   +10 more
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Advanced Thermal Interface Materials

MRS Proceedings, 2006
ABSTRACTThermal interface materials (TIMs) are used to dissipate thermal energy from a heat-generating device to a heat sink via conduction. The growing power density of the electronic device demands next-generation high thermal conductivity and/or low thermal resistance TIMs.
Yimin Zhang, Allison Xiao, Jeff McVey
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Comparison between CNT Thermal Interface Materials with Graphene Thermal Interface Material in Term of Thermal Conductivity

Materials Science Forum, 2020
Thermal interface material (TIM) had been well conducted and developed by using several material as based material. A lot of combination and mixed material were used to increase thermal properties of TIM. Combination between materials for examples carbon nanotubes (CNT) and epoxy had had been used before but the significant of the studied are not ...
Mazlan Mohamed, Mohd Nazri Omar, Mohamad Shaiful Ashrul Ishak, Rozyanty Rahman, Yahaya Nor Zaiazmin, Mohammad Khairul Azhar Abdul Razab, Mohd Zharif Ahmad Thirmizir   +6 more
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