Results 231 to 240 of about 146,341 (255)
Some of the next articles are maybe not open access.
Graphene-based thermal interface materials
2011 11th IEEE International Conference on Nanotechnology, 2011Thermal management in electronic circuits is becoming an important integral part of design considerations. Increasing power densities and speed of advanced computer chips motivate the search for more efficient thermal interface materials. Here we report preliminary results of experimental and theoretical investigations of the epoxy composites, which ...
Khan M. F. Shahil, Alexander A. Balandin
openaire +1 more source
Thermal Transfer in Graphene-Interfaced Materials: Contact Resistance and Interface Engineering
ACS Applied Materials & Interfaces, 2013We investigate here heat transfer across interfaces consisting of single- and few-layer graphene sheets between silicon carbides by performing nonequilibrium molecular dynamics simulations. The interfacial thermal conducitivity κI is calculated by considering graphene layers as an interfacial phase.
Hanxiong, Wang +3 more
openaire +2 more sources
Self–healing Thermal Interface Materials
2020Thermal interface materials (TIMs) are widely used as gap–filler materials between electronic devices such as LEDs and ICs and their heat sink and aim to control the heat dissipation and to provide mechanical anchoring. As the rated power densities of electronic devices are increasing rapidly, the TIMS are exposed to higher thermal and mechanical loads.
openaire +3 more sources
THERMAL CHARACTERIZATION OF THERMAL INTERFACE MATERIALS
Experimental Techniques, 2008C.I. Chen +5 more
openaire +1 more source
Thermal Interface Materials in the HPC Era
IMAPSource ProceedingsThe high performance computing (HPC) module market is seeing some enormous simultaneous changes. The compute needs of XPU and tensor processors are causing die area to grow, with higher areal power density, and HBM DRAM stacks are now located immediately adjacent to the processor.
Andy C. Mackie, Tim Jensen, David Saums
openaire +1 more source
Reliability for Thermal Interface Materials
Thermal interface materials (TIMs) are critical components in electronic packaging. Thermal greases are paste-like materials with high conductivity filler particles added to a polymer matrix to yield a high conductivity spreadable material. Throughout the operation of the electronic device, thermomechanical stresses lead to failure of thermal greases ...openaire +1 more source
Thermal Interface Materials in Electronic Packaging
2010With the continual increase in cooling demand for electronic packaging, there has been an increased focus within the microelectronics industry on developing high performance thermal solutions. Thermal interface materials (TIMs) play a key role in thermally connecting various components of the thermal solution.
openaire +1 more source