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Microstructural, Mechanical and Corrosion Performance of NbZr1-Ti64 Multi-Material Structure Fabricated via Wire Arc Directed Deposition. [PDF]

Materials (Basel)
Jadhav S, Kim DB, Adams A, Kusekar S, Borkar T, Ahsan S, Young D.   +6 more
europepmc   +1 more source

Candidate Coatings for Lead Fast Reactor Components: A Systematic Screening of Liquid-Lead Compatibility-Part I. [PDF]

Materials (Basel)
Ventrella A, Bussi F, Cico D, Ecclesia F, Salvi M, Vannini C, Pudoyer C, Loiacono D, García Ferré F.   +8 more
europepmc   +1 more source

A review of low-, medium-, and high-temperature thermoelectric materials for thermoelectric generators. [PDF]

iScience
Liu Z, Ge J, Jin J, Wu C, Wang K, Huang Q, Wang Q, Zhang Z, Tian B, Jiang Z.   +9 more
europepmc   +1 more source

Research on the Mechanism of High-Performance Aluminum Alloy Casting of Frozen Sand Mold Coupled with Negative Pressure. [PDF]

Materials (Basel)
Luo L, Luo C, Lv Q, Liang X, Wang L, Su Y, Guo J, Mi F, Chen C, Wang B.   +9 more
europepmc   +1 more source

RRAM-Based Neuromorphic Devices for Artificial-Intelligence Hardware: Device Physics, Materials, Processing, and Packaging. [PDF]

Micromachines (Basel)
Pyo SG.
europepmc   +1 more source

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Performance of Thermal Interface Materials

Small, 2022
AbstractThe thermal interface materials (TIMs) used for improving thermal contacts are considered in terms of the performance, performance consideration criteria, performance evaluation methods, and material development approaches. The performance is described mainly by the thermal contact conductance, which refers to the conductance across the thermal
Deborah Chung
exaly   +3 more sources

Superior thermal interface materials for thermal management

Composites Communications, 2019
Abstract Thermal interface materials (TIMs) have been widely used in various electronic devices and are crucial for next generation electronics such as flexible electronics. Ultrathin full carbon films with extraordinary high thermal conductivity (k) and promising mechanical strength have been well documented, but the brittleness (elongation at break~
Ming-Bo Yang, Rui-Ying Bao, Jun Chen
exaly   +2 more sources

Characterization of Thermal Interface Materials

2006 1st Electronic Systemintegration Technology Conference, 2006
In this paper new characterization equipment for thermal interface materials is presented. Thermal management of electronic products relies on the effective dissipation of heat. This can be achieved by the optimization of the system design with the help of simulation methods. The precision of these models relies also on the used material data.
Ralph Schacht, Daniel May, Bernhard Wunderle, Olaf Wittler, Astrid Gollhardt, Bernd Michel, Herbert Reichl   +6 more
openaire   +2 more sources

Thermal Interface Materials

2009
Increasing electronic device performance has historically been accompanied by increasing power and increasing on-chip power density both of which present a cooling challenge. Thermal Interface Material (TIM) plays a key role in reducing the package thermal resistance and the thermal resistance between the electronic device and the external cooling ...
Ravi Prasher, Chia-Pin Chiu
openaire   +4 more sources

Comparison between CNT Thermal Interface Materials with Graphene Thermal Interface Material in Term of Thermal Conductivity

Materials Science Forum, 2020
Thermal interface material (TIM) had been well conducted and developed by using several material as based material. A lot of combination and mixed material were used to increase thermal properties of TIM. Combination between materials for examples carbon nanotubes (CNT) and epoxy had had been used before but the significant of the studied are not ...
Mazlan Mohamed, Mohd Nazri Omar, Mohamad Shaiful Ashrul Ishak, Rozyanty Rahman, Yahaya Nor Zaiazmin, Mohammad Khairul Azhar Abdul Razab, Mohd Zharif Ahmad Thirmizir   +6 more
openaire   +1 more source