Results 31 to 40 of about 1,084,951 (305)

Influence of the clamping force on the power cycling lifetime reliability of press pack IGBT sub-module

open access: yesThe Journal of Engineering, 2019
The clamping force is the most important parameter of Press Pack IGBTs (PP IGBTs) as it not only affects the electrical, thermal, and mechanical characteristic, but also the long lifetime reliability.
Erping Deng   +5 more
doaj   +1 more source

An Experimental Investigation on the Heat Transfer Characteristics of Pulsating Heat Pipe with Adaptive Structured Channels

open access: yesEnergies, 2023
In recent years, the development of electronic chips has focused on achieving high integration and lightweight designs. As a result, pulsating heat pipes (PHPs) have gained widespread use as passive cooling devices due to their exceptional heat transfer ...
Jiangchuan Yu   +4 more
doaj   +1 more source

Thermal Resistance of Aeromonas hydrophila

open access: yesJournal of Food Protection, 1987
Thermal resistance of five strains of Aeromonas hydrophila (three clinical and two food isolates) was studied at 45 to 51°C in saline solution and raw milk. In addition, effects of growth temperature and growth phase on thermal resistance of the cells were also studied.
S A, Palumbo   +3 more
openaire   +2 more sources

Comparative study on the thermal performance of surface‐mounted devices light‐emitting diode packaging with poly(1,4‐cyclohexylenedimethylene terephthalate) and epoxy moulding compound frames

open access: yesIET Optoelectronics, 2022
With the emergence of the different light‐emitting diode (LED) packaging materials, the thermal analysis of LED device packaging with different materials has become urgent. The thermal performance of LED packaging with a poly(1,4‐cyclohexylenedimethylene
Dezhi Zhao   +3 more
doaj   +1 more source

Thermal transport across grain boundaries in polycrystalline silicene: a multiscale modeling

open access: yes, 2019
During the fabrication process of large scale silicene through common chemical vapor deposition (CVD) technique, polycrystalline films are quite likely to be produced, and the existence of Kapitza thermal resistance along grain boundaries could result in
Khalkhali, Maryam   +2 more
core   +1 more source

Measurement of substrate thermal resistance using DNA denaturation temperature [PDF]

open access: yes, 2009
Heat Transfer and Thermal Management have become important aspects of the developing field of uTAS systems particularly in the application of the the uTAS philosophy to thermally driven analysis techniques such as PCR.
Dalton, Tara   +2 more
core   +1 more source

Thermo-Energy Performance of Lightweight Steel Framed Constructions: A Case Study

open access: yesBuildings, 2022
The building sector continues to play an essential role in reducing worldwide energy consumption. The reduced consumption is accompanied by stricter regulation for the thermotechnical design of the building envelope.
Ligia Moga   +3 more
doaj   +1 more source

Dimension- and shape-dependent thermal transport in nano-patterned thin films investigated by scanning thermal microscopy [PDF]

open access: yes, 2017
Scanning thermal microscopy (SThM) is a technique which is often used for the measurement of the thermal conductivity of materials at the nanometre scale. The impact of nano-scale feature size and shape on apparent thermal conductivity, as measured using
Dobson, Phillip S.   +3 more
core   +1 more source

Feasibility and Preliminary Efficacy of Integrative Neuromuscular Training for Childhood Cancer Survivors: A Pilot Study

open access: yesPediatric Blood &Cancer, EarlyView.
ABSTRACT Background Survivors of childhood acute lymphoblastic leukemia (ALL) often exhibit early deficits in muscle and movement competence, which can compromise long‐term health. Integrative neuromuscular training (INT), a multifaceted approach combining fundamental movement activities with strength exercises, may help address these deficits during ...
Anna Maria Markarian   +7 more
wiley   +1 more source

Effect of air confinement on thermal contact resistance in nanoscale heat transfer

open access: yes, 2017
We report herein the pressure dependent thermal contact resistance (Rc) between Wollaston wire thermal probe and samples which is evaluated within the framework of an analytical model.
Al-Alam, Patricia   +4 more
core   +3 more sources

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