Results 211 to 220 of about 351,466 (302)

Nonequilibrium Period with Emergence of Marangoni Circulations in Meniscus Splitting

open access: yesAdvanced Materials Interfaces, EarlyView.
The emergence and evolution of Marangoni convection in the meniscus splitting phenomenon are investigated. During the mass circulation of viscous fluids, the confluence and bifurcation of polymer dispersions beneath the evaporative interface lead to the inhomogeneous densification of the skin layer.
Leijie Wu, Kosuke Okeyoshi
wiley   +1 more source

Label‐Free Sensing of Coronaviral Sequences via Kretschmann‐Configuration Reflectance Spectroscopic Ellipsometry: Sensitivity, Specificity, and Interfacial Effects

open access: yesAdvanced Materials Interfaces, EarlyView.
Spectroscopic ellipsometry in the Kretschmann‐Raether configuration (KRSE) is employed to characterize a DNA‐functionalized platform for viral sequence recognition. By merging SE with surface plasmon resonance, KRSE outperforms conventional SE, achieving nanomolar targeting through resonance wavelength shifts (δλ) measurements. Its enhanced interfacial
Silvia Maria Cristina Rotondi   +4 more
wiley   +1 more source

From the Discovery of the Giant Magnetocaloric Effect to the Development of High‐Power‐Density Systems

open access: yesAdvanced Materials Technologies, EarlyView.
The article overviews past and current efforts on caloric materials and systems, highlighting the contributions of Ames National Laboratory to the field. Solid‐state caloric heat pumping is an innovative method that can be implemented in a wide range of cooling and heating applications.
Agata Czernuszewicz   +5 more
wiley   +1 more source

Advanced Techniques for Scalable Woven E‐Textiles Manufacturing

open access: yesAdvanced Materials Technologies, EarlyView.
This review highlights recent advances in scalable weaving techniques for e‐textiles, emphasizing innovations in multilayer structures, conductive yarn integration, and loom modifications. It summarizes emerging materials, fabrication strategies, and performance considerations that enable reliable, durable, and industrially scalable woven electronic ...
Faisal Abedin   +2 more
wiley   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

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