Results 151 to 160 of about 9,375,541 (161)
Some of the next articles are maybe not open access.

Contactless Pre-Bond TSV Test and Diagnosis Using Ring Oscillators and Multiple Voltage Levels

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2014
Krishnendu Chakrabarty, Sergej Deutsch
exaly  

Monolithic 3D TSV-Based High-Voltage, High-Temperature Capacitors

Microelectronic Engineering, 2016
Tobias Erlbacher   +2 more
exaly  

Performance Evaluation of a 15-Level Inverter Using Two DC Sources With Lower Standing Voltage

International Journal of Electronics
Saikat Majumdar   +2 more
exaly  

A Low-Voltage Area-Efficient TSV I/O With QEC Realizing Data Rate Up to 15 Gb/s for TSV Interface

IEEE Journal of Solid-State Circuits
Kyomin Sohn   +2 more
exaly  

Through-Silicon via (TSV) Depletion Effect

2011
Myunghoi Kim, Joungho Kim, Jonghyun Cho
exaly  

A Symmetric Bridge-Based Pre-Bond TSV Faults Detection Method

IEEE Transactions on Instrumentation and Measurement
Huaguo Liang, Yingchun Lu, Tian Chen
exaly  

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