Results 161 to 170 of about 336,103 (238)
High‐κ Perovskite‐Like Ternary Niobium Oxide Dielectrics for 2D Electronics
High‐κ dielectrics are vital for scaled electronics. Here, a family of 2D high‐κ perovskite‐like ternary niobium oxides is synthesized via a molten salt‐assisted method. Their integration into FETs and logic gates reveals superior switching characteristics, providing a fresh material platform and new insights for the advancement of high‐performance 2D ...
Biao Zhang +10 more
wiley +1 more source
Materials and System Design for Self‐Decision Bioelectronic Systems
This review highlights how self‐decision bioelectronic systems integrate sensing, computation, and therapy into autonomous, closed‐loop platforms that continuously monitor and treat diseases, marking a major step toward intelligent, self‐regulating healthcare technologies.
Qiankun Zeng +9 more
wiley +1 more source
Recent Progress on Flexible Multimodal Sensors: Decoupling Strategies, Fabrication and Applications
In this review, we establish a tripartite decoupling framework for flexible multimodal sensors, which elucidates the underlying principles of signal crosstalk and their solutions through material design, structural engineering, and AI algorithms. We also demonstrate its potential applications across environmental monitoring, health monitoring, human ...
Tao Wu +10 more
wiley +1 more source
This study utilizes the van der Waals stacking of ferroelectric α$\alpha$‐In2Se3 to fabricate in‐plane artificial charged domain walls. These charged domain walls are electrically accessible, gate‐tunable, and show 2–9 orders of magnitude higher conductance than charged domain walls from thin film ferroelectrics, allowing their integration in field ...
Shahriar Muhammad Nahid +6 more
wiley +1 more source
Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya +3 more
wiley +1 more source
Advances in Halide Perovskites for Photon Radiation Detectors
This work highlights recent progress in perovskite‐based photon radiation detectors, covering organic–inorganic hybrid, inorganic, lead‐free double, and vacancy‐ordered halide perovskites. Their detection performance is compared, material‐specific advantages and challenges are examined, and provides insight into current limitations and future ...
Liangling Wang +3 more
wiley +1 more source
We are reporting the first‐time investigation of DPP‐based Organic Field‐Effect Transistor (OFET) devices with high‐stability of signal response in both of ambient and aqueous conditions with PBS solution. ABSTRACT Diketopyrrolopyrrole (DPP)–based conjugated polymers show strong promise for electronic applications, including bioelectronic gas sensors ...
Chattarika Khamhanglit +6 more
wiley +1 more source
This paper explores integrating organic electrochemical transistors (OECTs) with planarized 3D‐printed substrates, utilizing ironing to enhance surface suitability for printing, dispense printing for thick, low‐resistance silver electrodes, and inkjet printing for semiconductor deposition.
Mohamad Kannan Idris +3 more
wiley +1 more source
Site‐Selective Polyvinylpyrrolidone Adsorption Behavior for 3D Heterogeneous Integration
Site‐selective adsorption behavior is presented with polyvinylpyrrolidone on a Cu/SiO2 pattern wafer, which enables 3D heterogeneous integration. Owing to the site‐selective adsorption behavior and its corresponding electrostatic interaction between SiO2 nanoparticles and the Cu surface, the selectivity of Cu/SiO2 is arbitrarily controlled ...
Hosin Hwang +9 more
wiley +1 more source
Flexible monolithic 3D complementary circuits based on 2D semiconductor inks. [PDF]
Zou T +10 more
europepmc +1 more source

