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Self-balanced switched capacitors based thirteen level three-fold multilevel inverter for solar PV applications. [PDF]
Dewangan NK +4 more
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2'-O-Methylation maintains ribosome structural and translation integrity. [PDF]
Zhao Y +11 more
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A Q-analysis package for higher-order interactions analysis in Python and its application in network physiology. [PDF]
Smirnov N, Kurkin S, Hramov AE.
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UzbekPOS: A multi-domain dataset for Uzbek part-of-speech tagging. [PDF]
Sharipov M, Kuriyozov E, Vičič J.
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Protocol for extracting intergenic regions from annotated genomes using TIGRE. [PDF]
Dupin B +3 more
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Multimodal EEG, ECG, and video dataset of yoga practitioners during concentration and mind-wandering tasks. [PDF]
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TSV Replacement and Shield Insertion for TSV–TSV Coupling Reduction in 3-D Global Placement
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2015Through silicon via (TSV) cross coupling can seriously degrade circuit performance of 3-D ICs if it is not considered during design. In this paper, we propose two algorithms which combine coupling-aware TSV placement with shield insertion to yield better results than either technique alone.
Caleb Serafy, Ankur Srivastava 0001
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Design of adiabatic TSV, SWCNT TSV, and Air-Gap Coaxial TSV
2015 IEEE International Symposium on Circuits and Systems (ISCAS), 2015High performance three-dimensional (3D) through silicon via (TSV) interconnects are important for reliability, choice of the filler material is also a critical issue as thermal incompatibility, electromigration, and high resistivity are still a bottleneck.
Khaled Salah 0001, Yehea I. Ismail
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