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2'-O-Methylation maintains ribosome structural and translation integrity. [PDF]

open access: yesMol Cell
Zhao Y   +11 more
europepmc   +1 more source
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TSV Replacement and Shield Insertion for TSV–TSV Coupling Reduction in 3-D Global Placement

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2015
Through silicon via (TSV) cross coupling can seriously degrade circuit performance of 3-D ICs if it is not considered during design. In this paper, we propose two algorithms which combine coupling-aware TSV placement with shield insertion to yield better results than either technique alone.
Caleb Serafy, Ankur Srivastava 0001
exaly   +2 more sources

Design of adiabatic TSV, SWCNT TSV, and Air-Gap Coaxial TSV

2015 IEEE International Symposium on Circuits and Systems (ISCAS), 2015
High performance three-dimensional (3D) through silicon via (TSV) interconnects are important for reliability, choice of the filler material is also a critical issue as thermal incompatibility, electromigration, and high resistivity are still a bottleneck.
Khaled Salah 0001, Yehea I. Ismail
openaire   +1 more source

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