Results 171 to 180 of about 8,987 (189)

High-speed and high-quality TSV filling with the direct ultrasonic agitation for copper electrodeposition

Microelectronic Engineering, 2017
Wenhui Zhu, , Fuliang Wang
exaly  

TSV Fabrication

2014
Khaled Salah, Yehea Ismail, Alaa El-Rouby   +2 more
openaire   +1 more source

Characterization of a new strain of Taura syndrome virus (TSV) from Colombian shrimp farms and the implication in the selection of TSV resistant lines

Journal of Invertebrate Pathology, 2013
Luis Aranguren, Marcela Salazar
exaly  

TSV as pad

2023
GAO GUILIAN, LEE BONGSUB, FOUNTAIN JR GAIUS GILLMAN, UZOH CYPRIAN EMEKA, HABA BELGACEM, MIRKARIMI LAURA WILLS, KATKAR RAJESH   +6 more
openaire   +1 more source

TSV Redundancy: Architecture and Design Issues in 3-D IC

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2012
Ang-Chih Hsieh
exaly  

Modeling and Crosstalk Evaluation of 3-D TSV-Based Inductor With Ground TSV Shielding

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2017
Saikat Mondal
exaly  

A novel thermal-aware structure of TSV cluster in 3D IC

Microelectronic Engineering, 2016
Na Gong, Jingyan Fu, Jinhui Wang
exaly  

Taura syndrome virus (TSV) in Thailand and its relationship to TSV in China and the Americas

Diseases of Aquatic Organisms, 2005
Timothy W Flegel, Tw Flegel
exaly  

On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D Interconnect/Integrated Circuit (IC) Technology

Procedia Engineering, 2016
Nobumichi Tamura, A S Budiman
exaly  

Signal Shifting-based Reusable Redundant TSV Structure for Infrastructure TSV

2024 21st International SoC Design Conference (ISOCC)
Donghyun Han, Sunghoon Kim, Sungho Kang 0001   +2 more
openaire   +1 more source