Results 161 to 170 of about 8,987 (189)

Optimization of TSV Leakage in Via-Middle TSV Process for Wafer-Level Packaging

Electronics (Switzerland), 2021
Sun Qingqing
exaly  

TSV REDUNDANCY AND TSV TEST SELECT SCHEME

2022
SATO HOMARE, KONDO CHIKARA, IDE AKIRA
openaire   +1 more source

TSV Verification

2014
Khaled Salah, Yehea Ismail, Alaa El-Rouby   +2 more
openaire   +1 more source

PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2011
Taigon Song, Kiyeong Kim, Seungyoung Ahn   +2 more
exaly  

Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration

Microelectronic Engineering, 2011
Jan Vaes, Eric Beyne, Wim Dehaene
exaly  

TSV Processes

2015
Masahiko Tanaka, Makoto Sekine, Itsuko Sakai, Yutaka Kusuda, Tomoyuki Nonaka, Osamu Tsuji, Kazuo Kondo   +6 more
openaire   +1 more source

A novel guard method of through-silicon-via (TSV)

IEICE Electronics Express, 2018
Fengjuan Wang, Ningmei Yu
exaly  

Compact lateral thermal resistance modeling and characterization for TSV and TSV array

2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 2013
Zao Liu, Sahana Swarup, Sheldon X.-D. Tan   +2 more
openaire   +1 more source

R2-TSV: A Repairable and Reliable TSV Set Structure Reutilizing Redundancies

IEEE Transactions on Reliability, 2017
Sungho Kang, Minho Cheong
exaly  

The geographic distribution of Taura Syndrome Virus (TSV) in the Americas: determination by histopathology and in situ hybridization using TSV-specific cDNA probes

Aquaculture, 1999
Donald V Lightner, Jean-Robert Bonami, Bonnie T Poulos   +2 more
exaly