Results 181 to 189 of about 8,987 (189)

Through-Strata-Via (TSV) Parasitics and Wideband Modeling for Three-Dimensional Integration/Packaging

IEEE Electron Device Letters, 2011
Jian-Qiang Lu
exaly  

Silicon Effect-Aware Full-Chip Extraction and Mitigation of TSV-to-TSV Coupling

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2014
Yarui Peng, Sung Kyu Lim, Dusan Petranović   +2 more
exaly  

TSV PRODUCT, TSV SAMPLE AND PREPARATION METHOD THEREFOR

2023
openaire   +1 more source

TSV Filling

2011
openaire   +1 more source

TSV Allocation

2015
openaire   +1 more source

TSV Etching

2011
openaire   +1 more source

Technology review of CNTs TSV in 3D IC and 2.5D packaging: Progress and challenges from an electrical viewpoint

Microelectronic Engineering
exaly  

TSV LAYOUT STRUCTURE AND TSV INTERCONNECT STRUCTURE, AND FABRICATION METHODS THEREOF

2014
ZHANG WUZHI, CHEN XIAOJUN, LIU XUANJIE, ZHANG HAIFANG   +3 more
openaire   +2 more sources

TSV as pad

GAO GUILIAN, LEE BONGSUB, FOUNTAIN JR GAIUS GILLMAN, UZOH CYPRIAN EMEKA, HABA BELGACEM, MIRKARIMI LAURA WILLS, KATKAR RAJESH   +6 more
openaire   +1 more source