Results 31 to 40 of about 8,987 (189)

Modeling and Electromagnetic Analysis of Multilayer Through Silicon Via Interconnect for 3D Integration

International Journal of Antennas and Propagation, 2015
Convergence of multiple functions in a single device is the main thought behind the development of the current electronic trends. So, the requirement for higher integration in electronic devices has become more important in present days than in the past.
Zhaowen Yan, Ting Kang, Wei Zhang, Jianwei Wang   +3 more
doaj   +1 more source

TSV‐based common‐mode noise‐suppressing filter design and implementation

Electronics Letters, 2022
A through‐silicon via (TSV)‐based, common‐mode, noise‐suppressing filter (TSV‐CMF) with the silicon interposer process is proposed to improve the electromagnetic compatibility in 3D integrated circuits.
Zhensong Li, Huan Liu, Yunheng Sun, Yang Yang, Min Miao, Shenglin Ma, Yufeng Jin   +6 more
doaj   +1 more source

Fundamental Challenges, Physical Implementations, and Integration Strategies for Ising Machines in Large‐Scale Optimization Tasks

Advanced Electronic Materials, EarlyView.
Ising machines are emerging as specialized hardware solvers for computationally hard optimization problems. This review examines five major platforms—digital CMOS, analog CMOS, emerging devices, coherent optics, and quantum systems—highlighting physics‐rooted advantages and shared bottlenecks in scalability and connectivity.
Hyunjun Lee, Joon Pyo Kim, Sanghyeon Kim
wiley   +1 more source

Trichodysplasia spinulosa-associated polyomavirus (TSV) and Merkel cell polyomavirus: correlation between humoral and cellular immunity stronger with TSV. [PDF]

PLoS ONE, 2012
Merkel Cell Polyomavirus (MCV) is a common infectious agent likely to be involved in the pathogenesis of most Merkel cell carcinomas (MCC). Trichodysplasia spinulosa-associated polyomavirus (TSV), which exhibit high seroprevalence in general population ...
Arun Kumar, Anu Kantele, Tommi Järvinen, Tingting Chen, Heli Kavola, Mohammadreza Sadeghi, Klaus Hedman, Rauli Franssila   +7 more
doaj   +1 more source

Research of Vertical via Based on Silicon, Ceramic and Glass

Micromachines, 2023
With the increasing demand for high-density integration, low power consumption and high bandwidth, creating more sophisticated interconnection technologies is becoming increasingly crucial.
Wenchao Tian, Sixian Wu, Wenhua Li
doaj   +1 more source

Single‐Step Analog In‐Memory Matrix Computation in Three‐Dimensional Circuits

Advanced Intelligent Systems, EarlyView.
A wooden model illustrates a 3D memristive array designed for single‐step kernel convolutions. It shows how two‐dimensional input data are mapped into the 3D array and convolved in parallel with stored kernels. Color‐coded connection points represent programmed memory‐element values, with each color corresponding to a specific kernel weight.
Alireza Jaberi Rad, Koushik Kumar, Fatemeh Kiani, Yi Huang, Ali Abdel‐Maksoud, Zheshun Xiong, Yunzhi Ling, Wuyu Zhao, Qiangfei Xia   +8 more
wiley   +1 more source

Immunomodulatory activity of Tityus serrulatus scorpion venom on human T lymphocytes

Journal of Venomous Animals and Toxins including Tropical Diseases, 2015
Background Tityus serrulatus scorpion venom (TsV) contains toxins that act on K + and Na + channels and account for the venom’s toxic effects. TsV can activate murine peritoneal macrophages, but its effects on human lymphocytes have been poorly ...
Andrea Casella-Martins, Lorena R Ayres, Sandra M Burin, Fabiana R Morais, Juliana C Pereira, Lucia H Faccioli, Suely V Sampaio, Eliane C Arantes, Fabiola A Castro, Luciana S Pereira-Crott   +9 more
doaj   +1 more source

A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process

Metals, 2021
With the continuous miniaturization of electronic devices and the upcoming new technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation cellular networks (5G), etc., the electronics industry is achieving high-speed ...
Do Hoon Cho, Seong Min Seo, Jang Baeg Kim, Sri Harini Rajendran, Jae Pil Jung   +4 more
doaj   +1 more source

Host‐Specific Interactions Between Staphylococcus aureus and Pseudomonas aeruginosa Impair Epithelial Repair in Chronic Rhinosinusitis

International Forum of Allergy &Rhinology, EarlyView.
ABSTRACT Background Chronic rhinosinusitis (CRS) is frequently associated with polymicrobial biofilms involving Staphylococcus aureus and Pseudomonas aeruginosa. Interactions between these organisms are thought to influence disease severity, but the epithelial effects of exoproteins derived from patient‐matched cocultures remain poorly defined ...
Xiaohan Sun, Mahnaz Ramezanpour, George Bouras, Emma Barry, Alkis J. Psaltis, Peter‐John Wormald, Sarah Vreugde   +6 more
wiley   +1 more source

Investigating the Heat Stability and Inactivation Conditions of Decapod Iridescent Virus 1 (DIV1)

Animal Research and One Health, EarlyView.
Heat treatment effectively inactivates decapod iridescent virus 1 (DIV1) under milder conditions than current WOAH recommendations. DIV1 infectivity was eliminated at 56°C for 30 min, 60°C for 15 min, or 70°C for 1 min, providing optimized heat treatment strategies for aquaculture biosecurity and seafood safety.
Yonghui Feng, Xiaomeng Guo, Jingyi Xing, Liang Qiu, Jie Huang   +4 more
wiley   +1 more source