Results 41 to 50 of about 8,987 (189)

Molecular Characterization of an Isolate of Tobacco Streak Virus Naturally Infecting Areca catechu L. in China—A First Case in the Family Arecaceae

open access: yesPlants
Tobacco streak virus (TSV) has a wide range of natural host plants, yet it has not been detected in plants of the Arecaceae family. In Hainan, China, areca plants exhibited yellow-green chlorotic streaked leaves, and irregular chlorotic patches appeared ...
Xupeng Wang   +10 more
doaj   +1 more source

Infecção viral simples e dupla em Alstroemeria sp.

open access: yesOrnamental Horticulture, 1999
Amostras de Alstroemeria sp., provenientes de 2 regiões produtoras do Estado de São Paulo (Brasil) e da Itália (material quarentenado), foram submetidas a testes de transmissão mecânica, serológicos (DASELISA e decoração) e observações ao microscópio ...
Ligia M. L. Duarte   +4 more
doaj   +1 more source

Fatigue behavior of 3D stacked packaging structures under extreme thermal cycling condition

open access: yesMemories - Materials, Devices, Circuits and Systems, 2023
In deep space exploration environment, electronic devices face severe tests. C4 solder joints and TSV, as the weak links of the three-dimensional packaging structure, have a significant impact on the reliability of the packaging structure.
Xin Xu   +6 more
doaj   +1 more source

Nonadherence and uncontrolled arterial hypertension in Croatia—Insights from the May Measurement Month 2023 campaign and Hunting the silent killer programme

open access: yesBritish Journal of Clinical Pharmacology, EarlyView.
Aims To determine the prevalence of non‐adherence to antihypertensive medicines and to identify demographic and behavioral factors associated with non‐adherence in subjects enrolled in the May Measurement Month (MMM) 2023, as part of the permanent public health action Hunting the silent killer.
Valerija Bralić Lang   +12 more
wiley   +1 more source

Internal defects inspection of TSV 3D package based on thermal distribution analysis

open access: yesAIP Advances, 2021
A small aperture, fine pitch, and high aspect ratio have been the characteristics of through silicon via (TSV) 3D packaging technology. Thus, the requirements of TSV quality are becoming higher and higher.
Lei Nie, Yifan Huang, Mengran Liu
doaj   +1 more source

Impact of the pancreatic enzyme replacement therapy (PERT) shortage on prescribing in England: Analysis of national data

open access: yesBritish Journal of Clinical Pharmacology, EarlyView.
Aim Pancreatic enzyme replacement therapy (PERT) is essential for the management of pancreatic exocrine insufficiency. Since June 2023, the United Kingdom has been affected by a global shortage of PERT. We investigated the impact of this shortage on national prescribing trends for Creon, Nutrizym, Pancrex and Pangrol.
Teena S. Varghese   +6 more
wiley   +1 more source

Discovery of a new human polyomavirus associated with trichodysplasia spinulosa in an immunocompromized patient.

open access: yesPLoS Pathogens, 2010
The Polyomaviridae constitute a family of small DNA viruses infecting a variety of hosts. In humans, polyomaviruses can cause infections of the central nervous system, urinary tract, skin, and possibly the respiratory tract.
Els van der Meijden   +5 more
doaj   +1 more source

Fracture evolution of a thick soft protection layer and the water inrush mechanism in overburden under longwall mining

open access: yesDeep Underground Science and Engineering, EarlyView.
Through shear–tensile creep tests and viscoelastic modeling, the fracture evolution of thick soft protective layers is clarified. Results show thickness‐dependent rheological failure modes that govern four types of roof water inrush, providing a mechanism‐based framework for hazard prediction and control. Abstract In the Jurassic coal‐bearing strata of
Mengnan Liu   +4 more
wiley   +1 more source

Measuring Public Sentiment on Corporate Sustainability Through Big Data and Social Media Analytics

open access: yesBusiness Ethics, the Environment &Responsibility, EarlyView.
ABSTRACT Currently, corporate sustainability is primarily assessed through companies' own sustainability reports and evaluations conducted by NGOs and rating agencies. These approaches present several limitations, including potential reporting bias and limited transparency in evaluation methodologies. In response, this paper proposes CSR‐IRIS‐v2, a big
Adriana M. Barbeito‐Caamaño   +1 more
wiley   +1 more source

An integrated framework TSV-INet for arbitrarily distributed TSV interposer wafer warpage simulation

open access: yesMicrosystems & Nanoengineering
Through-silicon vias (TSVs) are densely integrated in TSV interposer wafers, and TSV-induced warpage can degrade downstream manufacturing yield. Fast, accurate design-stage warpage simulation is therefore essential. This study presents TSV-INet, a hybrid
Hanwen Cui   +13 more
doaj   +1 more source

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