Results 21 to 30 of about 8,987 (189)
Virtualization-Based Efficient TSV Repair for 3-D Integrated Circuits
IEEE Access, 2020 Three-dimensional (3-D) integration offers a promising solution to the technology scaling barriers. Reliability of the 3-D Integrated Circuits (ICs) is highly dependent on the integrity of the underlying interconnect.
Muhammad Imran +5 more
doaj +1 more source
Thermal distribution analysis of inner defects in TSV
E3S Web of Conferences, 2018 In order to uncover the external manifestations of TSV internal defects, the finite element models of typical internal defects, which were filling missing, axial cavity and end cavity, were established.
Jiang Chuan Kai +3 more
doaj +1 more source
Integrated through-silicon-via-based inductor design in buck converter for improved efficiency
Electrical engineering & Electromechanics, 2023 Introduction. Through-silicon-via (TSV) is one of the most important components of 3D integrated circuits. Similar to two-dimensional circuits, the performance evaluation of 3D circuits depends on both the quality factor and inductance.
A. Namoune +4 more
doaj +1 more source
Research and implementation of AC resistance calculation method for TSV array
Dianzi Jishu Yingyong, 2018 Through Silicon Via(TSV), as a key interconnection technology in 3D integrated circuits, is used to connect input and output of chips in different layers. When multiple TSVs with alternating current close to each other, will produce the proximity effect,
Zhao Jinglong, Miao Min
doaj +1 more source
Susceptibility-Weighted Imaging of the Anatomic Variation of Thalamostriate Vein and Its Tributaries. [PDF]
PLoS ONE, 2015 Thalamostriate vein (TSV) is an important tributary of the internal cerebral vein, which mainly drains the basal ganglia and deep medulla. The purpose of this study was to explore the anatomic variation and quality of TSV and its smaller tributaries ...
Xiao-fen Zhang +5 more
doaj +1 more source
Journal of Ophthalmology, 2018 Aim. To compare the anatomic and visual outcomes of 25-gauge (25G), and 27-gauge (27G) transconjunctival sutureless pars plana vitrectomy (TSV) for the management of primary rhegmatogeneous retinal detachment (RRD). Design.
Keiko Otsuka +6 more
doaj +1 more source
Advanced Healthcare Materials, EarlyView.Micro‐ and nano‐patterned elastin‐like recombinamer (ELR) hydrogels integrate bioactive matrix chemistry with defined surface topography. The combined cues promote rapid endothelial cell capture, alignment, and monolayer formation on soft substrates.
Jagoda Litowczenko +8 more
wiley +1 more source
Effects of varying the through silicon via liners thickness on their hoop stresses and deflections
The Journal of Engineering, 2017 Through silicon via (TSV) interconnect reliability is a problem in electronic packaging. The authors address the insertion losses, deflections which can result to separation of TSV layers and hoop stresses. These problems are due to different coefficient
Juma Mary Atieno +2 more
doaj +1 more source
Lipid Nanoparticle Co‐Delivery of mRNA and a Small Molecule Drug for Oral Cancer Chemoimmunotherapy
Advanced Materials, EarlyView.Co‐encapsulation of p53 mRNA and the small molecule ciclopirox within a lipid nanoparticle yields an all‐in‐one chemoimmunotherapy for oral squamous cell carcinoma. The platform engages caspase‐driven apoptosis in cancer cells while repolarizing tumor‐associated macrophages, achieving tumor reduction in both p53‐susceptible and p53‐resistant models and
Marshall S. Padilla +15 more
wiley +1 more source
Advanced Science, EarlyView.Pattern‐dependent etching is converted into a physical prior for intelligent reconstruction of high‐aspect‐ratio silicon structures. Combining YOLO‐Pose feature extraction with a topography network, the framework retrieves depth, sidewall angle, and scallop texture from minimal destructive observations, enabling accurate cross‐scale metrology and near ...
Shuyan He +4 more
wiley +1 more source