Auxeticity‑by‑Assembly converts freeform photovoltaics from cut‑defined layouts to assembly‑defined systems. Standardized interlocking units generate negative‑Poisson‑ratio, reconfigurable architectures, while hinge regions are wired by selectively activatable AgNW–GO@EGaIn composite interconnects and a folding‑enabled interconnector layer. A decimeter‑
Seok Joon Hwang +15 more
wiley +1 more source
In Situ X-Ray Imaging and Machine Learning in Ultrasonic Field-Assisted Laser-Based Additive Manufacturing: A Review. [PDF]
Fu Z +6 more
europepmc +1 more source
Inducing Ferromagnetism by Structural Engineering in a Strongly Spin‐Orbit Coupled Oxide
ABSTRACT Magnetic materials with strong spin‐orbit coupling (SOC) are essential for the advancement of spin‐orbitronic devices, as they enable efficient spin‐charge conversion, complex magnetic structures, spin‐valley physics, topological phases and other exotic phenomena.
Ji Soo Lim +19 more
wiley +1 more source
Simultaneous electrochemical detection of imipenem and meropenem using a Pt-Au bimetallic nanoparticle-decorated 3D graphene oxide modified glassy carbon electrode. [PDF]
Paghaleh HJ +3 more
europepmc +1 more source
We report phosphine‐oxide interlayers for wide‐bandgap perovskite solar cells, in which tuned P = O Lewis basicity enables selective passivation of buried NiOx/perovskite interfaces and introduces interfacial dipoles that strengthen the built‐in field.
JeeHee Hong +6 more
wiley +1 more source
Processing and Characterization of Air-Sprayed Bismuth Titanate Ultrasonic Transducers. [PDF]
Ghodousi M, Tittmann B, Lissenden CJ.
europepmc +1 more source
Atomic Layer Deposition in Transistors and Monolithic 3D Integration
Transistors are fundamental building blocks of modern electronics. This review summarizes recent progress in atomic layer deposition (ALD) for the synthesis of two‐dimensional (2D) metal oxides and transition‐metal dichalcogenides (TMDCs), with particular emphasis on their enabling role in monolithic three‐dimensional (M3D) integration for next ...
Yue Liu +5 more
wiley +1 more source
Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review. [PDF]
Meshki Zadeh P, Brand S, Dehghan-Niri E.
europepmc +1 more source
The hidden role of Cd segregation at grain boundaries is revealed in p‐type Mg3Sb2 by atom probe tomography and other advanced characterizations. Grain boundary Cd enrichment suppresses the SbMg+ hole‐killer formation and lowers potential barriers, enhancing electrical conductivity.
Zhou Li +12 more
wiley +1 more source
Low-frequency ultrasonic pulse-echo datasets for geometry determination of a reinforced concrete step specimen with embedded polystyrene foam cuboids in non-destructive testing. [PDF]
Grohmann M +3 more
europepmc +1 more source

