Results 171 to 180 of about 275,100 (301)

Microenvironment Modulation‐Based Nanomaterial‐Loaded Hydrogel Dressings for Diabetic Foot Ulcers: Research Progress and Future Perspectives

open access: yesAdvanced Materials Interfaces, EarlyView.
xx xx. ABSTRACT Diabetic foot ulcer (DFU) is a chronic complication of diabetes, primarily caused by hyperglycemia, peripheral vascular disease, and neuropathy. Characterized by persistent hyperglycemia, impaired perfusion, inflammation, and infection, DFUs pose significant challenges to healing and are associated with high morbidity and amputation ...
Tang Yuqing   +5 more
wiley   +1 more source

Nonmulberry Silk Fibroin Doping Boosts Charge Transfer and Charge Injection in Aligned Polypyrrole‐Silk Scaffolds for Low‐Voltage Neurostimulation

open access: yesAdvanced Materials Interfaces, EarlyView.
Conductive silk‐polypyrrole scaffolds couple redox stability with cell‐affinitive peptides present innately in an endogenous silk fibroin, enabling optimized electrical stimulation to drive neurite outgrowth. Findings establish electrochemical‐biological link for biomaterial design rules for smart nerve guidance conduits that can provide low voltage ...
Rajiv Borah   +5 more
wiley   +1 more source

A Microfluidic Multiplex Sorter for Strain Development

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
A new multiplex method for high‐throughput screening of yeast strains based on glucoamylase production is presented. Droplets containing single mutant yeast cells are incubated for enzyme production. A sorting platform divides mutants by their high‐ and mid‐activity levels.
Chiara Leal‐Alves   +6 more
wiley   +1 more source

Advances in Halide Perovskites for Photon Radiation Detectors

open access: yesAdvanced Materials Technologies, EarlyView.
This work highlights recent progress in perovskite‐based photon radiation detectors, covering organic–inorganic hybrid, inorganic, lead‐free double, and vacancy‐ordered halide perovskites. Their detection performance is compared, material‐specific advantages and challenges are examined, and provides insight into current limitations and future ...
Liangling Wang   +3 more
wiley   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

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