Results 141 to 150 of about 959,083 (268)

Composable free-space continuous-variable quantum key distribution using discrete modulation. [PDF]

open access: yesSci Adv
Jaksch K   +18 more
europepmc   +1 more source

Fabrication Routes for Ionic Conducting Fiber Strain Sensors

open access: yesAdvanced Engineering Materials, EarlyView.
Ionic conducting fiber strain sensors (ICFSs) offer compliant, textile‐integrable sensing. Thus far, the commercialization of ICFSs has been constrained by fiber fabrication routes. This review provides a fabrication‐centric analysis of ICFSs correlating processing strategies with material properties and scalability.
Leo John Kershaw   +3 more
wiley   +1 more source

Assessment of provably secure hybrid authenticated key exchange for dual-use applications. [PDF]

open access: yesEPJ Quantum Technol
Abelard S   +5 more
europepmc   +1 more source

Influence of TiC and TiN Ceramic Reinforcements on the Microstructure, Thermal Expansion Behavior, and Tensile Properties of Invar 36 Manufactured by Laser Powder Bed Fusion

open access: yesAdvanced Engineering Materials, EarlyView.
This study examines Invar composites reinforced with titanium carbide (TiC) and titanium nitride (TiN) using laser powder bed fusion (LPBF). It presents the influence of reinforcements on microstructure, tensile properties, and thermal expansion. Results show that TiC effectively strengthens Invar while maintaining low thermal expansion, whereas TiN ...
Ayodeji Nathaniel Oyedeji   +3 more
wiley   +1 more source

Error-Free Message . . . Composability Framework

open access: yes, 2005
This thesis introduces models for error-prone communication channels and functionalities for error-free communication in the Universal Composability framework. Realizing these functionalities enables protocols to make use of cryptographic errorcorrecting
David A. Wilson
core  

Gallium Microalloying in Bi–Sn Solders: Interfacial Phase Formation, Wettability, and Long‐Term Shear Reliability Under Isothermal Aging

open access: yesAdvanced Engineering Materials, EarlyView.
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová   +6 more
wiley   +1 more source

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