Results 151 to 160 of about 959,083 (268)

Investigating the Low‐Temperature Phase Stability of the Binary Ta–W System

Advanced Engineering Materials, EarlyView.
Atomistic simulations show that the binary Ta–W system forms ordered intermetallic phases, B2‐TaW and D03‐TaW3, as 0 K ground states. Configurational entropy, however, lowers the free energy of the disordered bcc solid solution, which becomes the stable phase above about 400 K.
Klemens Lechner, Anna Sophie Jelinek, Velislava Terziyska, Peter Wagatha, Wolfram Knabl, Christian Mitterer, Helmut Clemens, David Holec   +7 more
wiley   +1 more source

Diving Deep Into UC: Uncovering and Resolving Issues in Universal Composability [PDF]

Introduced by Canetti in 2001, Universal Composability (UC) is a widely adopted security model that enables the specification and proof of security for a broad range of protocols, offering strong security guarantees.
Céline Chevalier, Éric Sageloli
core  

A Novel Approach to Estimate the Transition Temperature via Dynamic Nanoindentation

Advanced Engineering Materials, EarlyView.
A new dynamic nanoindentation‐based method was developed that uses the stiffness ratio as an indicator of the elastic–plastic deformation contributions at different temperatures. The approach successfully identified transition temperatures in ferritic steel and distinguished them from continuously ductile austenitic steel.
Stefan Zeiler, Nikolaus Kostwein, Ronald Schnitzer, Christian Mitterer, Verena Maier‐Kiener   +4 more
wiley   +1 more source

Experimental composable key distribution using discrete-modulated continuous variable quantum cryptography. [PDF]

Light Sci Appl
Hajomer AAE, Kanitschar F, Jain N, Hentschel M, Zhang R, Lütkenhaus N, Andersen UL, Pacher C, Gehring T.   +8 more
europepmc   +1 more source

Materials‐Driven Additive Manufacturing for Electrical Machines: Qualification‐Oriented Design Beyond Geometric Freedom

Advanced Engineering Materials, EarlyView.
This perspective reframes additive manufacturing for electrical machines as a qualification‐limited materials and architecture design problem. It links process–structure–property–performance relationships to magnetic, conducting, dielectric, and thermal property windows, highlighting where AM can enable segmented magnetic circuits, permanent magnet ...
Dénes Fodor, Loránd Szabó
wiley   +1 more source

Asymmetric Protocols for Mode Pairing Quantum Key Distribution with Finite-Key Analysis. [PDF]

Entropy (Basel)
Li Z, Dou T, Xie Y, Kong W, Liu Y, Ma H, Tang J.   +6 more
europepmc   +1 more source

FastNano Liquid: An Automated Platform for Small‐Angle X‐ray Scattering‐Based Materials Discovery

Advanced Engineering Materials, EarlyView.
We present FastNano Liquid, an automated small‐ and wide‐angle X‐ray scattering platform for the combined synthesis and characterization of (nano)materials. The platform is coupled to varied reactor workflows for both in situ studies of reaction kinetics and ex situ screening of synthesis conditions to support machine learning‐guided exploration ...
Pierre‐Baptiste Flandrin, Émeline Cournède, Jens Krarup, Michael Lesa, Foyzul Hasan, Amandine Séné, Arnaud Lahouati, David Benhaiem, Jérémie‐Luc Sanchez, Simon Delacroix, Thierry Gacoin, Fabienne Testard, Damien Faivre, David Carriere, Corinne Chevallard, Olivier Taché, Mark A. Levenstein   +16 more
wiley   +1 more source

Compostable Multilayer Films with Tailored Gas Barrier and Biodegradation. [PDF]

ACS Omega
Benbettaieb N, Bher A, Mayekar PC, Limsukon W, Auras R.   +4 more
europepmc   +1 more source

4-bit adhesion logic enables universal multicellular interface patterning. [PDF]

Nature, 2022
Kim H, Skinner DJ, Glass DS, Hamby AE, Stuart BAR, Dunkel J, Riedel-Kruse IH.   +6 more
europepmc   +1 more source

Enhancement of the Through‐Thickness Electrical Conductivity of Carbon‐Fiber‐Reinforced Plastics Using Large Graphite Particles

Advanced Engineering Materials, EarlyView.
To enhance through‐thickness conductivity without sacrificing impregnation, large spherical graphite particles are intentionally employed in a low‐viscosity resin. Unlike finer conductive fillers, these particles remain outside the fiber bundles and accumulate in resin‐rich interlaminar regions during molding.
Keito Hosoe, Yu Zhou, Shintaro Kamiyama, Takao Okada, Tomohiro Yokozeki, Ryoma Tokonami, Tatsuhiro Takahashi   +6 more
wiley   +1 more source