Results 251 to 260 of about 130,994 (305)

Vacuum packaging cuts contamination

World Pumps, 2020
Hazard analysis and critical control point principles (HACCP) cover compressed air in food packaging, yet that control is missing when it comes to vacuum packaging. This article examines how vacuum pumps can minimise contamination and avoid common pitfalls.
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Hermeticity Investigation of MEMS Vacuum Packaging

2006 7th International Conference on Electronic Packaging Technology, 2006
The vacuum packaging is one of the most difficult problems to solve in the MEMS. In the MEMS vacuum packaging, the most important quality standard is the leak rate, which determines the vacuum maintaining in the vacuum packages. This paper presents two methods together to measure the leak rate.
Dong Lin, Zhiyin Gan, Xuefang Wang, Chenggang Wang, Honghai Zhang, Sheng Liu   +5 more
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MEMS vacuum packaging technology and applications

Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003), 2004
Vacuum packaging is essential for various kinds of microelectromechanical system (MEMS) devices for enhancing the performance and reliability. This paper presents our works on research on vacuum packaging of MEMS devices. A hermetical sealing technique has been developed, which involves the processes of anodic bonding for silicon and glass wafers with ...
Y. Jin, Z.F. Wang, P.C. Lim, D.Y. Pan, J. Wei, C.K. Wong   +5 more
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Getter free vacuum packaging for MEMS

Sensors and Actuators A: Physical, 2009
Abstract Quite a few MEMS devices such as accelerators, gyroscopes, infrared sensors need to work in vacuum environment to enhance their performance. The traditional vacuum packaging methods use getters to increase vacuum maintaining lifetime. However, the getter's characteristics of high temperature activation, powder pollution, large package size ...
Zhiyin Gan, Dexiu Huang, Xuefang Wang, Dong Lin, Sheng Liu   +4 more
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VACUUM PACKAGING FRESH MEATS - PRELIMINARY FINDINGS

1974
Vacuum packaging of fresh meats has received favorable reaction by consumers and retailers as indicated in recent test results.
Timberlake, William, Timberlake, William
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Vacuum packaged electromagnetic 2D scanning micromirror

Sensors and Actuators A: Physical, 2019
Abstract We herein present the design, fabrication, and wafer-level packaging of an electromagnetic biaxial scanning micromirror. The vacuum packaging of the micromirror was implemented by anodically bonding the glass cap wafer to both sides of the silicon substrate with the micromirror.
Seung-Han Chung, Seung-Ki Lee, Chang-Hyeon Ji, Jae-Hyoung Park   +3 more
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Wafer-level vacuum packaging for MEMS

Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, 1999
Vacuum packaging of high performance infrared (IR) MEMS uncooled detectors and arrays, inertial MEMS accelerometers and gyros, and radio frequency (rf) MEMS resonators is a key issue in the technology development path to low cost, high volume MEMS production. Wafer-level vacuum packaging transfers the packaging operation into the wafer fab.
R. Gooch, T. Schimert, W. McCardel, B. Ritchey, D. Gilmour, W. Koziarz   +5 more
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Vacuum underfill technology for advanced packaging

2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011
We developed vacuum assisted underfill technology for large die (>18 × 18 mm) with fine pitch area array bumps (< 150 μm pitch) to solve a critical underfill void issue. Material development and process optimization are the keys to realize a stable process for such an advanced package.
A. Horibe, M.-C. Paquet, M. Gaynes, C. Feger, K. Sakuma, J. U. Knickerbocker, Y. Orii, M. Hoshiyama, M. Hasegawa, T. Sato, H. Yoshii, O. Suzuki, K. Kotaka, T. Nagasaka, K. Terada, K. Ishikawa, Y. Hirayama   +16 more
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Vacuum Degree Measurement of MEMS Vacuum Package Based on DDS

2006 7th International Conference on Electronic Packaging Technology, 2006
This paper adopts quartz crystal as a sensor for measurement of vacuum degree which is integrated into the internal cavity of the MEMS package and is excited by an exciting source which is formed by Direct Digital Synthesizer (DDS). The corresponding voltage signal is provided as output by using phase and amplitude comparision circuits to compare the ...
Xiong Shi, Guangxi Zhu, Zhiyin Gan, Sheng Liu   +3 more
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Reliability of vacuum packaged MEMS gyroscopes

Microelectronics Reliability, 2005
The greatest challenge for the successful commercialization of MEMS (micro-electro-mechanical system) technology is proving its reliability. Of concern in particular are the reliability and long-term stability of wafer level vacuum packaged MEMS gyroscope sensors subjected to cyclic mechanical stresses at high frequencies. In this study, we carried out
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