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Characterization of through-silicon vias using laser terahertz emission microscopy

Nature Electronics, 2021
Kristof J P Jacobs   +2 more
exaly  

Solid-state qubits integrated with superconducting through-silicon vias

Npj Quantum Information, 2020
Donna-Ruth Yost   +2 more
exaly  

Bending reliability of screen-printed vias for a flexible energy module

Npj Flexible Electronics, 2020
Manu Kujala   +2 more
exaly  

Compact AC Modeling and Performance Analysis of Through-Silicon Vias in 3-D ICs

IEEE Transactions on Electron Devices, 2010
Chuan Xu, Kaustav Banerjee
exaly  

Broadband Monopolar Microstrip Patch Antenna With Shorting Vias and Coupled Ring

IEEE Antennas and Wireless Propagation Letters, 2014
Juhua Liu, Shao Y Zheng, Yuanxin li
exaly  

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