Results 131 to 140 of about 5,812 (264)

High‐Order Nonlinear Photonic Crystal with Ordered Structures for Giant Enhancement of Frequency Tripling

open access: yesAdvanced Science, EarlyView.
A meta‐YAG crystal with artificially order/disorder structures was fabricated to realize the efficient third‐harmonic generation at 343 nm with a conversion efficiency of 4.5×10−3, surpassing six orders of magnitude compared to bulk YAG crystal. Moreover, a wide spectral tunability from 331 to 356 nm was also achieved in the meta‐YAG, indicating its ...
Xiaotian Guo   +6 more
wiley   +1 more source

Electro‐Chemo‐Mechanical Coupling in Composite Cathodes of Sulfide‐Based All‐Solid‐State Batteries: Pathways, Degradation, and Design Rules

open access: yesAdvanced Science, EarlyView.
This review provides an integrated framework for achieving superior electrochemical performance in sulfide‐based all‐solid‐state batteries. It first delineates mechano‐electrochemical failure modes of cathode active materials and solid electrolytes, then outlines engineering principles for particle morphology, electronic and ionic conduction, and ...
Gawon Song   +4 more
wiley   +1 more source

Strong and Agile Wall-Climbing Robots Capable of Traversing Obstacles via Anisotropic Acoustic Adhesion. [PDF]

open access: yesResearch (Wash D C)
Yuan K   +8 more
europepmc   +1 more source

Ultrasound Activated Piezoelectric Dural Patches to Drive Endogenous Neural Stem Cell–Mediated Repair Traumatic Brain Injury

open access: yesAdvanced Science, EarlyView.
This study presents a wireless, non‐invasive strategy for neural repair by developing a biodegradable piezoelectric dural patch that, under transcranial ultrasound, generates localized electrical fields to drive endogenous neural stem cells toward neuronal differentiation and functional integration.
Pengbo Zhou   +7 more
wiley   +1 more source

Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics

open access: yesAdvanced Science, EarlyView.
This review surveys emerging materials for thermal management in advanced electronic packaging, with emphasis on ceramic substrates and thermal interface materials. Multiscale simulations and mechanistic analyses are highlighted, alongside the emerging role of artificial intelligence in predicting thermal properties and guiding design, offering ...
Yongjun Huo   +11 more
wiley   +1 more source

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