Adam Smith and market urbanism
Economic Affairs, EarlyView.
Eugenio Gerardo Garza Garza
wiley +1 more source
Finite element analysis of the influence of fragment size on biomechanical outcomes of various fixation techniques for posterolateral tibial plateau fractures. [PDF]
Hu Z, Xia Y, Shi G, Wu C, Li L.
europepmc +1 more source
Biomechanical analysis of interradicular and infrazygomatic miniscrew anchorage during two-step and en-masse retraction: A finite element study. [PDF]
Erdem R, Kılıç N.
europepmc +1 more source
Polycrystalline Diamond as a Potential Material for the Hard-on-Hard Bearing of Total Hip Prosthesis: Von Mises Stress Analysis [PDF]
Muhammad İmam Ammarullah +2 more
exaly +2 more sources
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Topological optimization of structures subject to Von Mises stress constraints
Structural and Multidisciplinary Optimization, 2009zbMATH Open Web Interface contents unavailable due to conflicting licenses.
Samuel Amstutz, Antonio André Novotny
exaly +3 more sources
Machine learning-based model to predict von Mises stress and chip reduction coefficient developed during dry turning of EN36C steel [PDF]
Vishal Mishra +2 more
exaly +2 more sources
Von mises stress for two-dimensional elasticity problems
Scripta Materialia, 1996The internal stresses arising from the misfit between the {gamma} and {gamma}{prime} phases of singlecrystal superalloy have a great influence on the mechanical properties of such materials at high temperatures. Several authors have determined these stresses by finite element calculations.
H. Boumedine, A. Coujou, J. Grilhé
openaire +2 more sources
The robust fail-safe topological designs based on the von Mises stress
Finite Elements in Analysis and Design, 2020Abstract For large-scale equipment, e.g. aerospace and architecture industry, it is valuable to guarantee that one structure could survive partial damages. Due to the location of the damage is unknown in prior, results in a high number of failure scenarios to be calculated when considering fail-safe requirement in topology optimization.
Hongxin Wang, Guilin Wen, Yi Min Xie
exaly +2 more sources
Von Mises Stress in Chemical‐Mechanical Polishing Processes
Journal of The Electrochemical Society, 1997In this paper we (i) describe a model for the stress distribution across a wafer during chemical-mechanical polishing, which is solved using I-DEAS (a commercial software package) and (ii) summarize the predicted effects of carrier film and pad compressibility on polishing nonuniformity.
D. Wang +5 more
openaire +1 more source
Study of the von Mises stress in RF MEMS switch anchors
2015 International Semiconductor Conference (CAS), 2015In this paper an analysis of the von Mises stress in the RF MEMS switch structures is presented. This study was performed to analyze and optimize the stress in the anchors area for switch structures addressed to K and W frequency bands. Different types of anchors were taken into consideration and a comparison of von Mises stress has been performed ...
D Vasilache, Gabriela Ciuprina
exaly +2 more sources

