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Humidity-driven shape morphing enhances fog harvesting in porous cactus spines
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Fatigue & Fracture of Engineering Materials & Structures, 2021
AbstractThe paper concerns an experimental study on the crack deflection angle in a semi‐circular disc made of an alkali‐activated fine‐grained composite under mixed‐mode conditions. This study is supplemented by an extensive numerical analysis that calculates the crack deflection angles via generalized (multi‐parameter) fracture criteria. It is proved
Lucie Malíková +3 more
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AbstractThe paper concerns an experimental study on the crack deflection angle in a semi‐circular disc made of an alkali‐activated fine‐grained composite under mixed‐mode conditions. This study is supplemented by an extensive numerical analysis that calculates the crack deflection angles via generalized (multi‐parameter) fracture criteria. It is proved
Lucie Malíková +3 more
openaire +3 more sources
Optics and Lasers in Engineering, 2017
Abstract The digital image correlation (DIC) method is used to obtain the coefficients of higher-order terms in the Williams expansion in a compact tension (CT) specimens made of polymethyl methacrylate (PMMA). The displacement field is determined by the correlation between reference image (i.e., before deformation) and deformed image.
Majid R. Ayatollahi, Mostafa Moazzami
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Abstract The digital image correlation (DIC) method is used to obtain the coefficients of higher-order terms in the Williams expansion in a compact tension (CT) specimens made of polymethyl methacrylate (PMMA). The displacement field is determined by the correlation between reference image (i.e., before deformation) and deformed image.
Majid R. Ayatollahi, Mostafa Moazzami
openaire +3 more sources
Application of the Williams Expansion near a Bi-Material Interface
A simplified model of a crack approaching a bi-material interface is modelled by means of the finite element method in order to investigate the significance of the higher-order terms of the Williams expansion for the proper approximation of the opening crack-tip stress near the bi-material interface.
Lucie Malíková, Stanislav Seitl
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