Results 261 to 270 of about 40,068 (339)
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Journal of Applied Microbiology, 2021
A cadmium (Cd)‐tolerant Bacillus megaterium strain A14 was used to investigate the effects and mechanisms of bacterial inoculation on peanut growth, Cd accumulation in grains and Cd fixation in Cd‐contaminated soil.
Mallavarapu Megharaj, Xiangzhi Yao
exaly +2 more sources
A cadmium (Cd)‐tolerant Bacillus megaterium strain A14 was used to investigate the effects and mechanisms of bacterial inoculation on peanut growth, Cd accumulation in grains and Cd fixation in Cd‐contaminated soil.
Mallavarapu Megharaj, Xiangzhi Yao
exaly +2 more sources
Journal of Bioscience and Bioengineering, 2019
Exopolysaccharides (EPSs) are high-molecular-weight carbohydrates with a wide range of biophysiological activities, such as antioxidant activity, immunostimulatory activity, antitumor activity, hepatoprotective activity, and antifatigue effects.
Kai Hou
exaly +2 more sources
Exopolysaccharides (EPSs) are high-molecular-weight carbohydrates with a wide range of biophysiological activities, such as antioxidant activity, immunostimulatory activity, antitumor activity, hepatoprotective activity, and antifatigue effects.
Kai Hou
exaly +2 more sources
[A14-Phenylalanine]Insulin: A New Synthetic Analogue
Hoppe-Seyler's Zeitschrift Für Physiologische Chemie, 1980An analogue of porcine insulin which differs from the native molecule in that the amino acid residue A14-tyrosine is replaced by phenylalanine has been synthesized. The [PheA14]A chain was synthesized by the fragment condensation method and purified as tetra-S-sulfonate by ion-exchange chromatography on DEAE-cellulose at pH 5.6. Conversion of the tetra-
Waleed Danho +2 more
exaly +3 more sources
PPA and Scaling Potential of Backside Power Options in N2 and A14 Nanosheet Technology
2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023This paper evaluates Power-Performance-Area (PPA) tradeoffs and integration challenges of three types of backside power connections: Through Silicon Via in the Middle Of Line (TSVM), Self-Aligned Front-to-Back via (BPR) and Backside contact (BSC) for ...
S. Yang +9 more
semanticscholar +1 more source
2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023
This paper evaluates the impact of backside power delivery on the physical implementation of a commercial 64-bit high-performance block from ARM™ at the A14 node.
G. Sisto +13 more
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This paper evaluates the impact of backside power delivery on the physical implementation of a commercial 64-bit high-performance block from ARM™ at the A14 node.
G. Sisto +13 more
semanticscholar +1 more source
International Electron Devices Meeting, 2022
In this work, we comprehensively evaluate the impact of using backside power delivery network (BSPDN) for CPU of 2D and 3D designs at A14 node from the aspects of power, performance, area and thermal (PPAT) compared to identical designs of conventional ...
R. Chen +14 more
semanticscholar +1 more source
In this work, we comprehensively evaluate the impact of using backside power delivery network (BSPDN) for CPU of 2D and 3D designs at A14 node from the aspects of power, performance, area and thermal (PPAT) compared to identical designs of conventional ...
R. Chen +14 more
semanticscholar +1 more source
Cost analysis of device options and scaling boosters below the A14 technology node
Advanced Lithography, 2023The saturation in dimensional scaling has clearly impacted the semiconductor technology roadmap. The extension of patterning cliffs through new tools and multi-patterning lithography, as well as the introduction of innovative scaling boosters is helping ...
G. Mirabelli +14 more
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