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Composition and Microstructure of Chemically Vapor‐Deposited Boron Nitride, Aluminum Nitride, and Boron Nitride + Aluminum Nitride Composites

Journal of the American Ceramic Society, 1991
The composition and microstructure of dispersed‐phase ceramic composites containing BN and AIN as well as BN and AIN single‐phase ceramics prepared by chemical vapor deposition have been characterized using X‐ray diffraction, scanning electron microscopy, electron microprobe, and transmission electron microscopy techniques.
John A. Hanigofsky   +4 more
openaire   +1 more source

Phase Relations and Microstructural Development of Aluminum Nitride–Aluminum Nitride Polytypoid Composites in the Aluminum Nitride–Alumina–Yttria System

Journal of the American Ceramic Society, 2004
AlN–AlN polytypoid composite materials were prepared in situ using pressureless sintering of AlN–Al 2 O 3 mixtures (3.7–16.6 mol% Al 2 O 3
Inger‐Lise Tangen   +4 more
openaire   +1 more source

Reaction Synthesis of Aluminum Nitride–Boron Nitride Composites Based on the Nitridation of Aluminum Boride

Journal of the American Ceramic Society, 2002
Aluminum nitride–boron nitride (AlN–BN) composites were prepared based on the nitridation of aluminum boride (AlB 2 ). AlN powder was added to change the BN volume fraction in the obtained composites.
Guo‐Jun Zhang   +3 more
openaire   +1 more source

Photorefractive effect in undoped aluminum nitride

Optics Letters, 2010
We report our observation of the photorefractive effect in undoped aluminum nitride. We measured the coupling constant and the formation rate as a function of pump intensity at a wavelength of 405 nm in a two-wave mixing experiment. The photorefractive gain coefficient was 0.47 cm(-1) at I = 6.9 W/cm(2), and the actual saturated value was probably ...
Toru Nagai   +3 more
openaire   +2 more sources

Preparation and characterization of silica-doped aluminum nitride–aluminum nitride polytypoid composites

Ceramics International, 2005
Abstract Fine-grained AlN–AlN polytypoid composites doped with SiO 2 were prepared in situ by pressureless sintering of AlN–Al 2 O 3 mixtures (3.7 and 10.5 mol% Al 2 O 3 ) at 1870 °C using Y 2 O 3 as sintering aid. SiO 2 -doping (1 wt.%) was used to stabilize the AlN polytypoids and reduce the average grain size of the polytypoids.
Inger-Lise Tangen   +4 more
openaire   +1 more source

ChemInform Abstract: Composition and Microstructure of Chemically Vapor‐Deposited Boron Nitride, Aluminum Nitride, and Boron Nitride + Aluminum Nitride Composites.

ChemInform, 1991
AbstractChemInform is a weekly Abstracting Service, delivering concise information at a glance that was extracted from about 100 leading journals. To access a ChemInform Abstract of an article which was published elsewhere, please select a “Full Text” option. The original article is trackable via the “References” option.
J. A. HANIGOFSKY   +4 more
openaire   +1 more source

Deposition and characterization of non-conducting silicon nitride, aluminum nitride and titanium-aluminum nitride thin films

Surface and Coatings Technology, 1993
Abstract Dielectric thin films of silicon nitride and aluminum nitride were deposited by r.f. and d.c. magnetron reactive sputtering respectively. Titanium-aluminum nitride thin films were prepared by d.c.-r.f. magnetron reactive sputtering codeposition.
I.J.R. Baumvol   +4 more
openaire   +1 more source

Fabrication and Characterization of Aluminum Nitride/Boron Nitride Nanocomposites by Carbothermal Reduction and Nitridation of Aluminum Borate Powders

Journal of Nanoscience and Nanotechnology, 2008
In order to fabricate aluminum nitride/boron nitride (AlN/BN) nanocomposites by pressureless sintering, the present study investigated the synthesis of AlN-BN nanocomposite powders by carbothermal reduction and nitridation of aluminum borate powders. Homogeneous mixtures of alumina (Al2O3), boric acid (H3BO3), and carbon powder were used to synthesize
Takafumi, Kusunose   +3 more
openaire   +2 more sources

Aluminum Nitride (AIN)

1999
Aluminum nitride (A1N) has a large band gap (∼6 eV at 300 K), a high thermal conductivity (∼3.2 W cm−1 K1 at 300 K), and large piezoelectric constants (∼∣2−5∣×10−10 cm/V at 300 K) (see Ref. [1]). AIN has also excellent insulator and passivation properties, low dispersion of permittivity, and low dielectric loss. These make it useful for numerous device
openaire   +1 more source

Aluminum Nitride Composite Films

1997
The paper is concerned with thermodynamical, structural and kinetic factors responsible for the formation of aluminum nitride composite films. As such we consider A1N films deposited or grown on the substrates with nonidentical chemical composition and structure made of single crystal (Al203, 6H-SiC, Si), polycrystalline (polycrystalline diamond films,
B. V. Spitsyn   +4 more
openaire   +1 more source

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